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318 Half Day Rd #189
Buffalo Grove, IL 60089, USA

 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

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Hefei City, China

  Phone: +86 139 5605 4600 
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Applications for Electrically Conducting



United Adhesives Inc. makes two categories of Electrically Conductive Adhesives (ECA), silver filled silicones (Silductor series) and silver filled epoxies (Eposolder series), in both one-part and two-part systems. They are either dispensable or screen /stencil printable. The Eposolder series provides superior bonding strength to most common metal/alloy surfaces while maintaining high electrical & thermal conductivity
.

The typical applications are for mounting of heat sensitive dies or components in sensors, disk drive, flip-chip, die attach assembly or packaging, MEMS, LED Driver ICs, CCD chip attach, wafer lamination, CSP. Epoxy based ECAs provide electrically conductive bonding between components and mounting surfaces, and serve as thermal interface material for conducting heat through heat spreader. They are alternatives for solder replacement, chip bonding, and lead terminations.

 

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.

 

 

 

Name

Features / Advantages

Rheology

Part

Volume Resistivity
(Ohm-cm)

Hardness / Modulus

Adhesion
Al/Al, psi

Cure Rate

Silductor 6310

High conductivity. Low stress silicone based. High moisture resistance. Reworkable.

41,000 cPs

1-part

< 5x10―4

Shore A = 45

>150

125C 60 min

Silductor 6350

Low cost alternative with Ag coated Cu as conducting media

42,000 cPs

1-part

< 2x10―3

Shore A = 68

>180

125C 60 min

Silductor 6381

Low cost alternative with Ag and Cu hybrid as conducting media

85,000 cPs

1-part

< 1x10―3

Shore A = 80

> 230

125C 60 min

Eposolder 6510

High electrical conductivity. Strong bonding strength. Dispensable and printable

35,000 cPs

1-part

< 2x10―4

Shore D = 78

> 1200

125C 1hr, or 85C 2 hrs

Eposolder 6537

Fast cure (snap cure) epoxy-silver. Strong bonding strength. Dispensable and printable

48,000 cPs

1-part

< 2x10―4

Shore D = 85

> 1500

180C 15 sec, 125C 5 min

Eposolder 6763

Epoxy based low cost alternative with Ag coated Cu as conducting media

47,000 cPs

1-part

< 5x10―3

Shore D = 60

> 800

125C 60 min

Eposolder 6869

High electrical and thermal conductivity (11 W/mK). Strong bonding strength

98,000 cPs

1-part

< 1x10―4

Shore A = 70

> 400

125C 60 min

Other Products

Eposolder 6503, 6520, 6522, 6526, 6761 One or two part epoxy based systems with various modifications
E-Shielding products, including acrylic Ag-Cu based E-Shield 6037 and carbon based E-Shield 6410
, provide conductive coating, RF / EMI shielding solutions
Refer to website to check the details of the properties

 

Anisotropic conductive adhesives (ACA) provide high-speed interconnection for flip chip, fine pitch chip-on-film (COF), and chip-on-glass (COG) LCD packaging, and various fine pitch assemblies. They are often used as interconnect material in mainstream applications such as flat panel displays, LCD, smart card, camera modules, mobile phones, direct access sensors, semiconductor packages and RFID tags.

United Adhesives makes Au-based ACAs, and Ag-based low cost ACAs for these applications. They all have a rapid snap-cure speed at elevated temperatures in seconds with a thermo-compression. They forms a structural bonding to various substrates and films with conductivity only in z-direction while remaining insulation in the x,y plane.

 
 

 

Name

Features / Advantages

Rheology

Part

Volume Resistivity
(Ohm-cm)

Hardness / Modulus

Adhesion
Al/Al, psi

Cure Rate

AE6080

Z-axis anisotropic electrically conductive adhesive. Gold coated nickel as filler, 2.5 um. Snap cure with compressing

26,000 cPs

1-part

> 1x10―12 (x, y dir);

z dir < 0.1 Ohm-mm2

Shore D = 88

> 1800

180C 4 to 6 sec. 150C 20 sec

AE6075

Z-axis anisotropic electrically conductive adhesive. Gold coated nickel as filler, 5.0 um. Snap cure with compressing

25,000 cPs

1-part

> 1x10―12 (x, y dir);

z dir < 0.1 Ohm-mm2

Shore D = 86

> 1600

180C 4 to 6 sec. 150C 20 sec

AE6025

Z-axis anisotropic electrically conductive adhesive. Silver coated copper as filler, 6.0 um. Snap cure with compressing

25,000 cPs

1-part

> 1x10―12 (x, y dir);

z dir < 0.5 Ohm-mm2

Shore D = 82

> 1600

180C 4 to 6 sec. 150C 20 sec

 

   
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