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Applications for Sealing and Media Protection
United Adhesives Inc. provides various dielectric gels and
adhesives for electronic potting / encapsulating applications.
They have following features:
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High dielectric strength for voltage insulation
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Soft rubber and flexible to couple thermal stress
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Some products provide high thermal conductivity
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Some products provide superior high voltage resistance
They are typically applied to pot or encapsulate parts and
cavities, seal lids, covers, housings, connectors, or coat
various electronic parts to provide dielectric insulation,
vibration dampening, thermal stress coupling, etc.
Click the name of the adhesive in following Table to access
its technical datasheet (TDS) in PDF file.
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Name
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Features / Advantages
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Rheology
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Hardness / Modulus
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Dielectric Strength
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Adhesion
Al/Al, psi
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Cure Profile
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Silcoat 7021
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Moisture cure soft silicone gel. Sprayable
& dispensable. Easy apply. Excellent protection of
moisture, media, & corrosion.
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1-part liquid
600 cPs
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Shore A =32
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450 V/mil
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N/A
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1.8mm / 24 hrs
2.5mm / 72 hrs @ 25C 50%RH
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Silcoat 8022
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Soft coating and potting gel. Sprayable & dispensable. Excellent moisture
& media resistance.
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1:1 mixing,
3,000 cPs
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Shore A = 35
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450 V/mil
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N/A
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125C 15 min
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Silcoat 8026
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Soft Non-Sag gel. Dispensable. Excellent moisture and media resistance
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1:1 mixing,
25,000 cPs
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Shore A = 40
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450 V/mil
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N/A
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125C 15 min
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SP4011
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Readily flowable. Thermal cure to form firm rubbery dielectric
gel. Non-corrosive.
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1-part gel
560 cPs
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Shore
A = 20
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> 480
V/mil
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N/A
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125C 60
min
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SP4012
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Readily flowable. Thermal cure to form firm rubbery dielectric
gel. Non-corrosive.
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2-part gel
450 cPs
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Shore
OO = 35
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> 480
V/mil
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N/A
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125C 30
min
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EP1238
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Low viscosity epoxy potting adhesive. Good bond to various substrates
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1:1 mixing, 3,000 cPs
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Shore D = 50
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> 500
V/mil
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> 2500
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25C 8 hrs;
80C 60 min
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Other Products
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SP4017 is thixotropic version encapsulant. OE1582,
OP4047 are
optical encapsulants
Refer to website to check the details of the properties
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Silicone rubber based RTV sealants / adhesives from United
Adhesives Inc. provide strong bonding to most common plastics
and metals with excellent thermal stress release and water
resistance. Epoxy based sealants / adhesives provide strong
structural bonding to most common plastics and metals with
strong oil and chemical resistance.
They are used to bond and seal electronic devices, components,
equipment, connections, cover plates, housings, etc; make
formed-in-place gaskets; assemble and repair electronic
devices. They can also be applied as general-purpose sealants
for other applications
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Name
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Features / Advantages
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Rheology
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Hardness / Modulus
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Elongation
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Adhesion
Al/Al, psi
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Cure Profile
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MC7130
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Moisture cure silicone. Long elongation. Low
stress, non-sag. Strong bonding strength
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1-part paste
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Shore A = 43
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300%
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150 psi
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Tack free time 45 min @ 24C 50%RH
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BS8311
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Heat cure to form silicone rubber. Non-corrosion sealant. Strong
bonding to most plastics
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1-part, dispensable
45,000 cPs
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Shore A = 47
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280%
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> 600
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125C 60 min
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BS8350
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Heat cure to form silicone rubber. Non-corrosion sealant. Strong
bonding to most plastics
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1-part paste
non-sag
110,000 cPs
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Shore A = 62
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250%
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550 psi
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125C 60 min
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BS8440
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Two part. Heat cure to form silicone rubber. Non-corrosion sealant
/ adhesive.
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1:1 mixing
40,000 cPs
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Shore A = 51
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240%
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> 550 psi
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25C 12 hrs; |
125C 15 min
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EP1611
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Flexible epoxy, room temp curable
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60,000 cPs
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Shore A = 60
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50%
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> 1500
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25C 12 hours;
125C 30 min
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EP1646
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High voltage resistant sealant based on non-slump epoxy
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2-part (2:1)
22,000 cPs
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6.2 GPa
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N/A
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> 1600
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25C 12 hrs;
125C 8 min
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