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Europe, & Worldwide
318 Half Day Rd #189
Buffalo Grove, IL 60089, USA

 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

Contact in China and Asia 
High & New Technology
Industrial Development Park
6-1023 Tianzhu Rd.
Hefei City, China

  Phone: +86 139 5605 4600 
 china@UnitedAdhesives.com 

 

 

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Applications for Thermal Conducting and Heat Dissipation


United Adhesives Inc. makes thermally conductive adhesives (TCA) for bonding electronic devices with heat dissipations. They have following features:

       Very high thermal conductivity.
       High bonding strength to most common plastics and metals
       Soft rubber and flexible (Thermondbond series) to couple thermal stress while dissipating heat
       High dielectric strength for voltage insulation

Potential Uses
For high heat dissipation bonding in automotive electronics, semiconductors, and telecommunications, typically applied between a high heat power device and heat sink; any places where require coupling thermal stress while dissipating heat, or require thermally conductive vibration dampening; attachment of PCB to heat sink, cooling fans to devices, bonding or encapsulation of powder devices.

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.







 

Name

Features / Advantages

Rheology

Part

Thermal Conductivity

Hardness / Modulus

Adhesion
Al/Al, psi

Cure Rate

Thermobond 3513

Silicone with high bonding Strength. Low stress

Flowable
56,000 cPs

1-part

1.4 W/mK

Shore A =70

> 600

125C

60 min

Thermobond 3517

Silicone with high thermal conductivity. Strong bonding. Non-Slump

Thixotropic,

120,000 cPs

1-part

1.9 W/mK

Shore A = 90

> 550

125C

60 min

Thermobond 3831

Boron nitride filled for very high thermal conductivity

Thixotropic,

230,000 cPs

1-part

3.2 W/mK

Shore A = 63

580

125C

45 min

ET1628

High thermal conductivity. High bonding Strength. Easy flow. Rmt curable.

220,000 cPs

2-part

2 : 1

2.3 W/mK

Shore D = 70

> 1500

25C 8hrs, or 105C 10 min

ET1643

High thermal conductivity. High bonding Strength. Easy flow. Low CTE.

210,000 cPs

2-part

1 : 1

1.7 W/mK

6.7 GPa

> 1800

25C 18hrs, or 125C 30 min

ET1645

High thermal conductivity. Good flow. High bonding Strength.

50,000 cPs

1-part

2.3 W/mK

Shore D = 90

> 1000

125C

30 min

TF2619

High thermal conductivity gap filling silicone

Thixotropic,

230,000 cPs

1-part

1.9 W/mK

Shore OO=40

N/A

125C

45 min

Eposolder 6869

Silver filled epoxy for extremely high thermal conductivity

98,000 cPs

1-part

11 W/mK

Shore A = 70

> 400

125C

60 min

Other Products

Thermobond 3508, 3519, 3821, 3830 One or two-pat silicone systems with various modifications
ET1608, 1642, 1645NS, 1653BN, 1655, 1658 One or two part epoxy systems with various modifications
Refer to website to check the details of the properties



   
United Adhesives Inc.
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