有机硅类粘合剂  
 环氧树脂类粘合剂   
 热管理用粘合材料  
 涂层和浇灌   
 密封应用粘合材料  

 

中国和亚太地区联系方式
Contact in Asia & China
  Hi-Tech Industrial Park
 6-1023 Tianzhu Rd.
   Hefei City, China    
   +86 139 5605 4600   
   china@UnitedAdhesives.com   


北美地区联系方式 
Contact in North America
318 Half Day Rd #189
Buffalo Grove, IL 60089, USA
 
 +1 (224) 436-0077 
sales@UnitedAdhesives.com


其它地区联系方式
Worldwide Contact
 
+1 (224) 848-2348   
info@UnitedAdhesives.com

 

 

  公司产品  
  应 用   


 
  
              导电应用

 

美国联合胶粘剂两类导电胶(ECA),银填充的硅胶(Silductor系列)和银填充的环氧树脂(Eposolder系列),单组 或双组分组成。它们既可用于滴注,也可用于筛孔式(screen) 或镂花式(stencil) 模板印刷。本页所列的Silductor系列导电粘合剂有优良的柔软性,能有效地降低元器件与粘结面之间的热应力,同时保持高度的导电和导热性。

典型的应用包括传感器、磁盘驱动器中的构件的安装,flip-chip,芯片,模块,整套件,MEMSLED驱动器的IC CCD 芯片,晶片, CSP,等等的表面安装或包装。导电粘合剂为此类电子器件提供了优良的导电和导热界面。他们是替代焊料,芯片粘接和铅焊的替代品。

 
 

 

Name

Features / Advantages

Rheology

Part

Volume Resistivity
(Ohm-cm)

Hardness / Modulus

Adhesion
Al/Al, psi

Cure Rate

Silductor 6310

High conductivity. Low stress silicone based. High moisture resistance. Reworkable.

41,000 cPs

1-part

< 5x10―4

Shore A = 45

>150

125C 60 min

Silductor 6350

Low cost alternative with Ag coated Cu as conducting media

42,000 cPs

1-part

< 2x10―3

Shore A = 68

>180

125C 60 min

Silductor 6381

Low cost alternative with Ag and Cu hybrid as conducting media

85,000 cPs

1-part

< 1x10―3

Shore A = 80

> 230

125C 60 min

Eposolder 6510

High electrical conductivity. Strong bonding strength. Dispensable and printable

35,000 cPs

1-part

< 2x10―4

Shore D = 78

> 1200

125C 1hr, or 85C 2 hrs

Eposolder 6537

Fast cure (snap cure) epoxy-silver. Strong bonding strength. Dispensable and printable

48,000 cPs

1-part

< 2x10―4

Shore D = 85

> 1500

180C 15 sec, 125C 5 min

Eposolder 6763

Epoxy based low cost alternative with Ag coated Cu as conducting media

47,000 cPs

1-part

< 5x10―3

Shore D = 60

> 800

125C 60 min

Eposolder 6869

High electrical and thermal conductivity (11 W/mK). Strong bonding strength

98,000 cPs

1-part

< 1x10―4

Shore A = 70

> 400

125C 60 min

Other Products

Eposolder 6503, 6520, 6522, 6526, 6761 One or two part epoxy based systems with various modifications
E-Shielding products, including acrylic Ag-Cu based E-Shield 6037 and carbon based E-Shield 6410
, provide conductive coating, RF / EMI shielding solutions
Refer to website to check the details of the properties

 

各向异性导电胶 (ACA) 为倒装芯片 (Flip-Chip),细间距芯片上薄膜(COF),玻璃上芯片(COG) LCD包装,以及各种细间距组件提供高速导电互联。它们经常被用来作为应用于诸如平板显示器,液晶显示器,智能卡,相机模块,手机,直接访问式传感器,半导体封装和RFID标签等的互连材料。

美国粘合剂公司提供各种各向异性导电胶。有的ACAs使用基于金镊为导电粒子,有的则用银基导电粒子以达到较低成本的ACAs。在热压情况下, 它们都能在几秒钟内迅速固化, 与各种基材和薄膜形成良好的结构粘接,且只在z方向上导电,而在XY平面绝缘。

 
 

Name

Features / Advantages

Rheology

Part

Volume Resistivity
(Ohm-cm)

Hardness / Modulus

Adhesion
Al/Al, psi

Cure Rate

AE6080

Z-axis anisotropic electrically conductive adhesive. Gold coated nickel as filler, 2.5 um. Snap cure with compressing

26,000 cPs

1-part

> 1x10―12 (x, y dir);

z dir < 0.1 Ohm-mm2

Shore D = 88

> 1800

180C 4 to 6 sec. 150C 20 sec

AE6075

Z-axis anisotropic electrically conductive adhesive. Gold coated nickel as filler, 5.0 um. Snap cure with compressing

25,000 cPs

1-part

> 1x10―12 (x, y dir);

z dir < 0.1 Ohm-mm2

Shore D = 86

> 1600

180C 4 to 6 sec. 150C 20 sec

AE6025

Z-axis anisotropic electrically conductive adhesive. Silver coated copper as filler, 6.0 um. Snap cure with compressing

25,000 cPs

1-part

> 1x10―12 (x, y dir);

z dir < 0.5 Ohm-mm2

Shore D = 82

> 1600

180C 4 to 6 sec. 150C 20 sec

 

   
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