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密封和媒介保护应用
美国联合胶粘剂公司提供了不同的介电粘合剂,电子灌封粘合剂。
它们具有以下特点:
- 具有较高的介电强度, 对电压有优良的介电绝缘能力。
- 有机硅为基质的灌装剂具有优良的柔软性,有效地降低热应力。
- 有些灌装剂提供优良的导热性能。
- 有些对高电压有优良的绝缘能力。
- 多数为中性、无腐蚀的粘合剂和密封剂。
- 有良好的对潮湿,油类和化学制品的抵抗能力。
它们通常用于电子零件和腔体的封装, 灌装。对密封盖,外壳,连接器等的粘结,或对各种电子部件提供介电绝缘密封涂层,用于减震,热应力耦合粘结等。
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Name
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Features / Advantages
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Rheology
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Hardness / Modulus
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Dielectric Strength
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Adhesion
Al/Al, psi
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Cure Profile
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Silcoat 7021
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Moisture cure soft silicone gel. Sprayable
& dispensable. Easy apply. Excellent protection of
moisture, media, & corrosion.
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1-part liquid
600 cPs
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Shore A =32
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450 V/mil
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N/A
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1.8mm / 24 hrs
2.5mm / 72 hrs @ 25C 50%RH
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Silcoat 8022
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Soft coating and potting gel. Sprayable & dispensable. Excellent moisture
& media resistance.
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1:1 mixing,
3,000 cPs
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Shore A = 35
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450 V/mil
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N/A
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125C 15 min
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Silcoat 8026
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Soft Non-Sag gel. Dispensable. Excellent moisture and media resistance
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1:1 mixing,
25,000 cPs
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Shore A = 40
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450 V/mil
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N/A
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125C 15 min
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SP4011
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Readily flowable. Thermal cure to form firm rubbery dielectric
gel. Non-corrosive.
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1-part gel
560 cPs
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Shore
A = 20
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> 480
V/mil
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N/A
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125C 60
min
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SP4012
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Readily flowable. Thermal cure to form firm rubbery dielectric
gel. Non-corrosive.
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2-part gel
450 cPs
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Shore
OO = 35
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> 480
V/mil
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N/A
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125C 30
min
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EP1238
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Low viscosity epoxy potting adhesive. Good bond to various substrates
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1:1 mixing, 3,000 cPs
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Shore D = 50
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> 500
V/mil
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> 2500
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25C 8 hrs;
80C 60 min
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Other Products
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SP4017 is thixotropic version encapsulant. OE1582,
OP4047
are optical encapsulants
Refer to website to check the details of the properties
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本公司设计生产的有机硅橡胶类常温固化粘合剂和密封剂(RTV)对常用塑料和金属有着较强的粘合力,有良好的抗水性和较小的热应力。而环氧树脂类常温固化粘合剂和密封剂对常用塑料和金属能提供强力结构性粘结。同时具有较强的抗油和抗化学品侵蚀的能力。
它们主要用于粘结和密封电子装置,构件,设备,接头接口,封盖,底座,等等;制作既成式(form-in-place)的垫圈;用来组合和修理电子设备等。它们也能够在其它工业和应用领域作为粘合剂和密封剂来使用。
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Name
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Features / Advantages
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Rheology
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Hardness / Modulus
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Elongation
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Adhesion
Al/Al, psi
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Cure Profile
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MC7130
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Moisture cure silicone. Long elongation. Low
stress, non-sag. Strong bonding strength
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1-part paste
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Shore A = 43
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300%
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150 psi
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Tack free time 45 min @ 24C 50%RH
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BS8311
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Heat cure to form silicone rubber. Non-corrosion sealant. Strong
bonding to most plastics
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1-part, dispensable
45,000 cPs
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Shore A = 47
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280%
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> 600
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125C 60 min
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BS8350
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Heat cure to form silicone rubber. Non-corrosion sealant. Strong
bonding to most plastics
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1-part paste
non-sag
110,000 cPs
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Shore A = 62
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250%
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550 psi
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125C 60 min
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BS8440
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Two part. Heat cure to form silicone rubber. Non-corrosion sealant
/ adhesive.
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1:1 mixing
40,000 cPs
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Shore A = 51
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240%
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> 550 psi
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25C 12 hrs; |
125C 15 min
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EP1611
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Flexible epoxy, room temp curable
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60,000 cPs
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Shore A = 60
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50%
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> 1500
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25C 12 hours;
125C 30 min
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EP1646
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High voltage resistant sealant based on non-slump epoxy
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2-part (2:1)
22,000 cPs
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6.2 GPa
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N/A
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> 1600
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25C 12 hrs;
125C 8 min
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