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导热和散热的应用
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我们的导热粘合剂（TCA）粘接电子设备的同时提供热耗散。他们具有以下特点：
- 很高的导热性能
- 与常用塑料和金属能形成很高的粘结力。
- 柔软的橡胶特性使其在导热的同时又能有效地降低热应力。
- 高介电性可用于高电压的导热绝缘。
其用途是用于航空，汽车，计算机，半导体，和电讯等电子工业，以及任何要求导热和粘合的同时又能降低热张力的应用，或者既需要导热，又需要提供震动阻尼的地方；例如电路板与散热体的粘合，冷却扇与机体间的粘结，高发热、高耗能部件或设备的粘结或浇注等。.
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Name
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Features / Advantages
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Rheology
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Part
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Thermal Conductivity
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Hardness / Modulus
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Adhesion
Al/Al, psi
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Cure Rate
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Thermobond
3513
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Silicone with high bonding Strength. Low stress
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Flowable
56,000 cPs
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1-part
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1.4 W/mK
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Shore A =70
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> 600
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125C
60 min
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Thermobond
3517
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Silicone with high thermal conductivity. Strong bonding. Non-Slump
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Thixotropic,
120,000 cPs
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1-part
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1.9 W/mK
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Shore A = 90
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> 550
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125C
60 min
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Thermobond
3831
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Boron nitride filled for very high thermal conductivity
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Thixotropic,
230,000 cPs
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1-part
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3.2 W/mK
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Shore A = 63
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580
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125C
45 min
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ET1628
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High thermal conductivity. High bonding Strength. Easy flow. Rmt
curable.
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220,000 cPs
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2-part
2 : 1
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2.3 W/mK
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Shore D = 70
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> 1500
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25C 8hrs, or 105C 10 min
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ET1643
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High thermal conductivity. High bonding Strength. Easy flow. Low
CTE.
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210,000 cPs
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2-part
1 : 1
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1.7 W/mK
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6.7 GPa
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> 1800
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25C 18hrs, or 125C 30 min
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ET1645
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High thermal conductivity. Good flow. High bonding Strength.
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50,000 cPs
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1-part
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2.3 W/mK
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Shore D = 90
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> 1000
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125C
30 min
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TF2619
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High thermal conductivity gap filling silicone
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Thixotropic,
230,000 cPs
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1-part
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1.9 W/mK
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Shore OO=40
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N/A
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125C
45 min
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Eposolder 6869
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Silver filled epoxy for extremely high thermal conductivity
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98,000 cPs
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1-part
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11 W/mK
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Shore A = 70
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> 400
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125C
60 min
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Other Products
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Thermobond 3508,
3519,
3821,
3830
– One or two-pat silicone systems with various modifications
ET1608,
1642,
1645NS,
1653BN,
1655,
1658
– One or two part
epoxy systems with various modifications
Refer to website to check the details of the properties
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