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 Contact in North America,
Europe, & Worldwide
318 Half Day Rd #189
Buffalo Grove, IL 60089, USA

 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

Contact in China and Asia 
High & New Technology
Industrial Development Park
6-1023 Tianzhu Rd.
Hefei City, China

  Phone: +86 139 5605 4600 
 china@UnitedAdhesives.com 

 

 

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Dielectric Potting Adhesives

United Adhesives Inc. provides various dielectric adhesives for electronic potting applications.

They have following features:

-                High dielectric strength for voltage insulations.

-                Soft rubber and flexible to couple thermal stress.

-                Some products provide high thermal conductivity.

-                Some products provide superior high voltage resistance.

-                Silicone gels provide superior moisture resistance.

-                Epoxy potting provide oil and chemical resistance.

They are typically applied to pot or encapsulate parts and cavities, seal lids, covers, housings, connectors, or coat various electronic parts to provide dielectric insulation, vibration dampening, thermal stress coupling, etc.

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.


Name

SP4012

SP4011

SP4017

OE1582

ET1642

EP1660

Chemical Base

Silicone

Silicone

Silicone

Epoxy

Epoxy

Epoxy

Features / Advantages

Translucent fluid silicone. Readily flowable. Thermal cure to form firm rubbery dielectric gel. Non-corrosive.

One part version of SP4012. Readily flowable. Thermal cure to form firmrubbery dielectric gel. Non-corrosive.

One part dielectric firm gel. Non-sag (thixotropic).

Transparent epoxy potting or sealing for Opto-Electronic Applications.

High thermal conductivity. High bonding Strength. Low CTE. Easy flow

High voltage resistance. Low arching effect. Strong oil and chemical resistance.

Typical Application

Pot / encapsulate parts & cavities. Seal housings, lids. Coat electronic parts. Vibration dampening Thermal stress coupling

Pot / encapsulate parts & cavities. Seal housings, lids. Coat electronic parts. Vibration dampening Thermal stress coupling

Encapsulate parts & cavities. Seal housings, lids. Coat electronic parts. Vibration dampening Thermal stress coupling

Applying on LED Glob-Top, Optical Lens & IR Lens, Fiber optical, Lens, Prism, Endoscopes or Light Guides, etc.

Potting or sealing for high heat dissipations in electronics.

For high voltage insulation seal or encapsulation. High voltage component bonding or coating.

Rheology

Flowable, Dispensable

Flowable, Dispensable

Dispensable

Capillary flowable

Flowable

Flowable, Dispensable

Appearance / Color

Translucent

Translucent

Opaque

Transparent

Grey - A
Amber - B

Milky White or Grey

Part / Component

A/B = 1: 1

One

One

A/B =2:1

Two parts (1:1)

A/B =1:1

Viscosity @25C (cps, after mixing)

450

560

1,500

1,500

90,000

6,000

Pot / Work life (hr)

2 hrs

N/A

N/A

60 min

30 min

90 min

Cure Rate

125C 30 min

125C 60 min

105C 90 min
125C 30 min

RmT 24hr
80C 60 min

85C 120 min
125C 30 min

125C 60 min

Storage

< 25C

< 5C

< 5C

< 25C

< 30C

< 25C

Shelf Life

6 months @ 4C

3 months @ < 5C

3 months @ <5C

12 month @ 24C

6 month @ 5C

6month @ 5C

Tg

-120C

-120C

-120C

80

85 to 125

125

CTE (ppm/C)
ASTM D3386-94

< 300

< 300

< 300

123 (above Tg)
58 (below Tg)

<100(> Tg)
< 30 (<Tg)

120 (above Tg)
60 (below Tg)

Modulus or Hardness

Shore OO = 35

Shore A = 20

Shore A = 42

Shore D = 77

Shore D = 70

5.6 Gpa

Volume Resistivity
(Ohm-cm)

> 10E14

>10E14

>10E14

>10E12

> 10E+12

> 10E12

Dielectric Strength (V/mil)

> 480 V/mil

> 480 V/mil

400 V/mil

> 500 V/mil

500 V/mil

> 800

Adhesion
(Al/Al Lap Shear)

N/A

N/A

N/A

> 1200 psi

> 1800 psi

> 1600 psi

Thermal Conductivity (W/mK)

N/A

N/A

N/A

N/A

1.5

N/A

   
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