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318 Half Day Rd #189
Buffalo Grove, IL 60089, USA

 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

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Hefei City, China

  Phone: +86 139 5605 4600 
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Epoxy Based Electrically Conductive Adhesives


Features


United Adhesives Inc. makes two categories of Electrically Conductive Adhesives (ECA), silver filled silicones (Silductor series) and silver filled epoxies (Eposolder series), in both one-part and two-part systems. They are either dispensable or screen /stencil printable. The Eposolder series provides superior bonding strength to most common metal/alloy surfaces while maintaining high electrical & thermal conductivity.

Potential Uses

The typical applications are for mounting of heat sensitive dies or components in sensors, disk drive, flip-chip, die attach assembly or packaging, MEMS, LED Driver IC's, CCD chip attach, wafer lamination, CSP. Epoxy based ECAs provide electrically conductive bonding between components and mounting surfaces, and serve as thermal interface material for conducting heat through heat spreader. They are alternatives for solder replacement, chip bonding, and lead terminations.

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.



Name

Eposolder
6510

Eposolder
6522

Eposolder
6537

Eposolder
6761

Eposolder
6763

Eposolder
6869

Chemical Base

Epoxy/ Ag

Epoxy / Ag

Epoxy/ Ag

Epoxy/ Ag-Cu

Epoxy/ Ag-Cu

Epoxy / Ag

Features / Advantages

High electrical & thermal conductivity. Strong bonding strength. One component. Strong bonding strength.

Flexible epoxy to reduce thermal stress. High electrical & thermal conductivity.

Snap cure. High electrical & thermal conductivity. Very low out-gassing. Strong bonding strength.

Flexible epoxy to reduce thermal stress. Low cost. High electrical & thermal conductivity.

One part, dispensable and printable. Low cost. Solvent-free. High thermal stability

Very high thermal conductivity. Strong bonding strength. Long room temp pot life

Typical Application

For die attach, solder replacement, chip bonding, lead terminations, printed circuit, EMI / RFI shielding.

For die attach, low temp chip bonding, lower stress conducting bonding applications

For die attach, solder replacement, chip bonding, lead terminations, printed circuit, EMI / RFI shielding.

Low stress bonding & conducting in Sensors, Filters, Crystal Oscillators, MEMS, LCD, Driver ICís, CCD chip attach, etc.

For die attach, chip bonding, lead terminations, printed circuit, EMI / RFI shielding.

For die attach, solder replacement, chip bonding, lead terminations, printed circuit, EMI / RFI shielding.

Rheology

Dispensable
Printable

Printable

Dispensable and Printable

Dispensable and Printable

Dispensable and Printable

Dispensable and Printable

Part / Component

One

One

One

One

One

One

Viscosity (25C, cps)

35,000

41,000

48,000

39,000

47,000

98,000

Thixotropic Index
(0.5 /5 rpm)

3.2

3.5

3.6

3.0

3.2

3.0

Density (g/ml)

4.6

3.6

4.3

3.6

3.6

3.3

Work life (hr)

24

24

6 Months

24

24

10 Days

Cure Rate

85C 60 min
125C 60 min

80C 3 hrs
125C 20 min

125C 5 min
1850C 15 sec

125C 60 min

80C 6 hrs
125C 60 min

125C 60 min

Storage

-40 C

-40 C

< 4C

-40 C

-40 C

< 4C

Shelf Life (days)

6 month @ -40C

6 month @ -40C

6 month @ 4C

6 month @ -40C

6 month @ -40C

6 month @ 4C

Thermal Stability

-40C to 180C

-55C to 180C

-40C to 180C

-50C to 230C

-40C to 180C

-40C to 150C

Tg

150 C

n.a.

140 C

n.a.

n.a.

90 C

CTE (ppm/C)

<110 (above Tg)
<40 (below Tg)

< 160

<125 (above Tg)
<42 (below Tg)

< 210

<130

147 (above Tg)
56 (below Tg)

Hardness (ASTM D2240)

Shore D = 78

Shore A = 42

Shore D = 85

Shore A = 72

Shore D = 60

Shore A = 70

Volume Resistivity
(Ohm-cm)

< 2x10-4

< 2x10-4

< 2x10-4

< 1x10-3

< 5x10-3

< 1x10-4

Adhesion
(Al/Al Lap Shear, psi)

> 1200 psi

> 400 psi

> 1500 psi

> 400 psi

> 800 psi

> 400 psi

Thermal Conductivity (W/mK)

>5

>5

1.8

> 4

>4

11

 

 
 
 
 
 
 
 

   

   
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