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Features / Advantages
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Impregnating type flexible epoxy. Thermal cure to form dielectric
protective coating or potting.
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Two-part
for room temp curable.Good
adhesion to various substrates
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Flexible
underfill or encapsulant.
One-component. Readily
flowable.
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Flexible
coating or encapsulant.
Two-component. Readily
flowable.
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Fast flow low viscosity. High bonding strength. Room temperature
curable.
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Typical Application
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Pot / encapsulate parts & cavities. Coat electronic parts. Vibration dampening. Thermal stress coupling
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Encapsulate parts & cavities. Seal housings, lids. Coat electronic parts. Vibration dampening Thermal stress coupling
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For under-filling or encapsulating electronic parts and
components such as BGA, chip-on-board, bare die, CSP etc.
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For under-filling or encapsulating electronic parts and
components such as BGA, chip-on-board, bare die, CSP etc.
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For coating, impregnating, potting, and sealing electronic components
and devices.
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