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Features / Advantages
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Impregnating type flexible epoxy. Thermal cure to form dielectric
protective coating or potting.
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Two-component,
dispensable,
rubber-toughened epoxy.
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Flexible
underfill or encapsulant.
One-component. Readily
flowable.
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Flexible
underfill or encapsulant.
Two-component. Readily
flowable.
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Optical clear flexible epoxy adhesive. High bonding Strength. Room
temperature curable.
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Typical Application
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Pot / encapsulate parts & cavities. Coat electronic parts. Vibration dampening. Thermal stress coupling
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Encapsulate parts & cavities. Seal housings, lids. Coat electronic parts. Vibration dampening Thermal stress coupling
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For under-filling or encapsulating electronic parts and
components such as BGA, chip-on-board, bare die, CSP etc.
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For under-filling or encapsulating electronic parts and
components such as BGA, chip-on-board, bare die, CSP etc.
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Applying on LED glob-top, optical lens & IR lens, fiber optical,
lens, prism, endoscopes or light guides, etc.
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