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Features / Advantages
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Very Soft / Flexible Epoxy. Rubber like
property offering flexibility and chemical stability.
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Transparent epoxy potting or sealing
for optical or Opto-Electronic Applications.
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High Tg formulation for high temperature
stability. Strong oil and chemical resistance
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Very Low CTE formulation. Excellent oil and chemical resistance
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Thixotropic (non-sag) epoxy. Low CTE.
Very strong bonding to many plastics and surfaces.
Strong oil and chemical resistance.
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High Voltage resistance. Low arching
effect. Strong oil and chemical resistance.
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Typical Application
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For low stress bonding and flexible
encapsulation. Bond to PBT, PPS, Nylon, PC, Phenolic
& other difficult materials.
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Applying on LED Glob-Top, Optical Lens
& IR Lens, Fiber optical, Lens, Prism, Endoscopes
or Light Guides, etc.
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For applications that require high temperature
stability in semiconductor and automotive electronics
such as power devices and processors.
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For applications that require extremely
low CTE bonding such as silicone / ceramic bonding,
ignition coil potting.
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For severe thermal shock, vibration
bonding applications. Structural bonding applications.
Oil and media resistance applications.
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For high voltage insulation seal or
encapsulation. High voltage component bonding or coating.
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CTE (ppm/C)
ASTM D3386-94
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< 150
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< 160 (above Tg)
< 80 (below Tg)
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< 120 (above Tg)
< 60 (below Tg)
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< 60 (above Tg)
< 18 (below Tg)
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62 (above Tg)
19 (below Tg)
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120 (above Tg)
60 (below Tg)
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