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Features / Advantages
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1-part moisture Cure. Long elongation.
Non-Sag. Stress free. Strong bond to PBT, ABS, Nylon
plastics.
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Non-corrosive, 1- part moisture cure.
Strong bond to aluminum and most plastics. Stress
compliant.
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Non-corrosive 1-part moisture cure.
Strong bond to aluminum & most plastics. Stress
compliant.
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1-part fast moisture cure. Strong bonding
to PBT, ABS, Nylon plastics.
Stress compliant.
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Addition heat fast cure. Room temp curable.
Non-Corrosive. Strong bond to most plastics. Stress
compliant.
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Flexible epoxy formulation. Two part
for fast cure. Room temperature curable.
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Typical Application
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Bond & seal electronic devices,
housings, covers, etc. extreme thermal stress release;
formed-in-place gaskets.
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Bond & seal electronic devices that
exposes to high temperature & humidity; make formed-in-place
gaskets.
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Bond & seal electronic devices,
connectors, cover plates etc. Making formed-in-place
gaskets. General purpose sealant
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Assemble & repair electronic devices.
Bond components exposed to fuels, oils; make formed-in-place
gaskets. Seal joints on lines.
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Bond & seal electronic devices.
Good oil resistance. Seal lead, housing. Attaching
baseplate; Gasketing; Connector seal.
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For low stress bonding & flexible
seal. Bond to PBT, PPS, Nylon, PC, Phenolics and other
difficult materials.
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