|
Features / Advantages
|
Screen/Stencil Printable. High electrical
& thermal conductivity. Low Thermal Stress. Very
Low ionic Contamination. High moisture resistance.
Reworkable.
|
Silver copper hybrid powder filled electrical
& thermal conductivity. Low Thermal Stress. Very
Low ionic Contamination. High moisture resistance.
Reworkable. Low cost.
|
High electrical & thermal conductivity.
Low Thermal Stress. Very Low ionic Contamination.
High moisture resistance. Reworkable.
|
For low stress, electrically connecting
applications. Very Low ionic Contamination. High moisture
resistance. Reworkable.
|
|
Typical Application
|
For extremely low stress soldering /
connecting / conducting applications such as in Sensors,
Filters, Crystal Oscillators, MEMS, LCD Driver IC’s,
CCD chip attach, Wafer Lamination, CSP, etc.
|
For extremely low stress soldering /
connecting / conducting applications such as
in Sensors, Filters, Crystal Oscillators, MEMS,
LCD Driver IC’s, CCD chip attach, Wafer Lamination,
CSP, etc.
|
For low stress soldering / connecting
/ conducting applications such as in Sensors, Filters,
Crystal Oscillators, MEMS, LCD Driver IC’s, CCD chip
attach, Wafer Lamination, etc.
|
Low cost silver alternative electrically
conductive adhesive for conducting in semiconductor
and automotive electronics applications.
|
