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Europe, & Worldwide
318 Half Day Rd #189
Buffalo Grove, IL 60089, USA

 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

Contact in China and Asia 
High & New Technology
Industrial Development Park
6-1023 Tianzhu Rd.
Hefei City, China

  Phone: +86 139 5605 4600 
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Silicone Based Electrically Conductive Adhesives

Features

United Adhesives Inc. makes two categories of Electrically Conductive Adhesives (ECA), silver filled silicones (Silductor series) and silver filled epoxies (Eposolder series), in either one-part or two-parts system. They can be dispensable or screen /stencil printable. The Silductor series provide significant stress compliance while maintaining high electrical & thermal conductivity.

Applications

The typical applications are for mounting of heat sensitive components with electrically conductive path such as die attach, chip attach, and groundings. Silicone based ECAs provide significant stress compliance between components and mounting surfaces while serving as electrically conductive and thermally conductive interface material between mounted components and heat spreader.

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.


Name

Silductor 6201

Silductor 6381

Silductor 6310

Silductor 6350

Chemical Base

Silicone / Silver

Silicone
Ag-Cu-Hybrid

Silicone / Silver

Silicone / Silver-Copper

Features / Advantages

Screen/Stencil Printable. High electrical & thermal conductivity. Low Thermal Stress. Very Low ionic Contamination. High moisture resistance. Reworkable.

Silver copper hybrid powder filled electrical & thermal conductivity. Low Thermal Stress. Very Low ionic Contamination. High moisture resistance. Reworkable. Low cost.

High electrical & thermal conductivity.Low Thermal Stress. Very Low ionic Contamination. High moisture resistance. Reworkable.

For low stress, electrically connecting applications. Very Low ionic Contamination. High moisture resistance. Reworkable.

Typical Application

For extremely low stress soldering / connecting / conducting applications such as in Sensors, Filters, Crystal Oscillators, MEMS, LCD Driver ICís, CCD chip attach, Wafer Lamination, CSP, etc.

For extremely low stress soldering / connecting / conducting applications such asin Sensors, Filters, Crystal Oscillators, MEMS, LCD Driver ICís, CCD chip attach, Wafer Lamination, CSP, etc.

For low stress soldering / connecting / conducting applications such as in Sensors, Filters, Crystal Oscillators, MEMS, LCD Driver ICís, CCD chip attach, Wafer Lamination, etc.

Low cost silver alternative electrically conductive adhesive for conducting in semiconductor and automotive electronics applications.

Rheology

Printable

Printable

Dispensable

Dispensable

Part / Component

One

One Part

One

One

Viscosity @25C (cps)

78,000

85,000

41,000

42,000

Thixotropic Index

2.5

> 3

2.1

2.6

Density (g/ml)

4.9

4.6

4.9

3.3

Work life (hr)

> 72

> 72

>72

> 72

Cure Rate

150C 30 min
125C 60 min

150C 30 min
125C 60 min

150C 30 min
125C 60 min

150C 15 min
125C 30 min

Shelf Life (days)

6 months @ -15C

6 months @ -25C

6 months @ -15C

6 months @ -15C

Thermal Stability

-50C to 230C

-50C to 230C

-50C to 230C

-50C to 230C

Tg

-120C

-120C

-120C

-120C

CTE (ppm/C)
ASTM D3386-94

<100

<95

<100

<98

Hardness (ASTM D2240)

Shore A = 75

Shore A = 80

Shore A = 45

Shore A = 68

Tensile Strength (ASTM D638)

3.0 Mpa

3.5 Mpa

3.1 Mpa

3.5 Mpa

Volume Resistivity
(Ohm-cm)

< 5x10―4

< 5x10―3

< 5x10―4

< 5x10―3

Adhesion
(Al/Al Lap Shear, psi)

>150 psi

>150 psi

>150 psi

>180 psi

Thermal Conductivity (W/mK)

> 6

> 6

> 4

1.9

 


 
 
 
   
 

                      

   
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