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318 Half Day Rd #189
Buffalo Grove, IL 60089, USA

 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

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High & New Technology
Industrial Development Park
6-1023 Tianzhu Rd.
Hefei City, China

  Phone: +86 139 5605 4600 
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Thermally Conductive Adhesives - One Part

United Adhesives Inc. makes thermally conductive adhesives (TCA) for bonding electronic devices with heat dissipations. The major products are silicone based TCAs - Thermobond series. They have following features:

-                High thermal conductivity & heat dissipating capacity

-                Soft and flexible to couple thermal stress while dissipating heat

-                Automated dispense

-                High dielectric strength for voltage insulation

Potential Uses:

For high heat dissipation bonding in automotive electronics, semiconductors, and telecommunications, typically applied between a high heat power device and heat sink; any places where require coupling thermal stress while dissipating heat, or required thermally conductive vibration dampening; attachment of PCB to heat sink, cooling fans to devices, bonding or encapsulation of powder devices.

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.



Name

Thermobond 3508

Thermobond 3513

Thermobond 3517

Eposolder 6869

ET1645

ET1653BN

Chemical Base

Silicone

Silicone

Silicone

Epoxy / Silver

Epoxy

Epoxy

Features / Advantages

High bonding Strength. Easy flow.

High bonding Strength. Non-Slump.

Very high thermal conductivity. Strong bonding Non-Slump.

Extremely high thermal conductivity with silver filler.

High thermal conductivity. High bonding Strength. Low CTE. Easy flow

Boron nitride filled to provide very high thermal conductivity. High bonding Strength.

Typical Application

Strong bonding for heat dissipations in electronics.

Strong bonding for heat dissipations in electronics.

For high heat dissipations and bonding in electronics.

For extreme heat dissipation bonding in electronics such as die attach.

Strong bonding for heat dissipations in electronics.

For high heat dissipations in electronics.

Rheology

Flowable

Thixotropic, Dispensable

Thixotropic, Dispensable

Dispensable

Flowable

Dispensable

Viscosity @25C (cps)

56,000

78,000

120,000

98,000

50,000

230,000

Work life (hr)

> 8 hrs

> 8 hrs

> 8 hrs

> 10 days

16 hrs

> 8 hrs

Cure Rate

125C 60 min

125C 60 min

125C 60 min

125C 60 min

150C 20 min

125C 60 min

Shelf Life (days)

6 month @ < 4C

6 month @ < 4C

6 month @ < 4C

6 month @ -40C

6 month @ -40C

> 6 month @ -40C

Thermal Conductivity (W/mK)

0.8

1.2

1.9

11

1.7

3.0

Thermal Stability

-50 to 200C

-50 to 200C

-50 to 200C

-50C to 180C

-80C to 180C

-80C to 180C

Tg

-120C

-120C

-120C

125C

150

85 to 125

CTE (ppm/C)

140 ppm/C

120 pm/C

90 ppm/C

<147 (> Tg)
<56 (<Tg)

<80 (> Tg)
< 30 (<Tg)

146(> Tg)
53 (<Tg)

Hardness / Modulus

Shore A = 63

Shore A =70

Shore A = 90

Shore A = 70

Shore D = 70

6.5 GPa

Volume Resistivity
(Ohm-cm)

> 10E+14

> 10E+14

> 10E+14

Conductive

> 10E13

> 10E+12

Dielectric Strength (KV/mm)

450 V/mil

450 V/mil

450 V/mil

N/A

550 V/mil

500 V/mil

Adhesion (Al/Al Lap Shear, psi)

> 600 psi

> 600 psi

> 550 psi

> 400 psi

> 1000 psi

> 800 psi


 
 
 
   
 
   
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