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318 Half Day Rd #189
Buffalo Grove, IL 60089, USA

 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

Contact in China and Asia 
High & New Technology
Industrial Development Park
6-1023 Tianzhu Rd.
Hefei City, China

  Phone: +86 139 5605 4600 
 china@UnitedAdhesives.com 

 

 

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Thermally Conductive Adhesives - Two Part

United Adhesives Inc. makes thermally conductive adhesives (TCA) for bonding electronic devices with heat dissipations. The two-part products have following features:

-                High thermal conductivity & heat dissipating capacity

-                High bonding strength to most common plastics and metals

-                Flexible cure profile. Some are room temperature curable

-                Automated dispensable and printable

-                Soft and flexible to couple thermal stress while dissipating heat

-                High dielectric strength for voltage insulation

Structural bonding epoxy based thermally conductive adhesives are also available.

Potential Uses
For high heat dissipation bonding in automotive electronics, semiconductors, and telecommunications, typically applied between high heat power device and heat sink; or any places where require coupling thermal stress while dissipating heat, or require thermally conductive vibration dampening; attachment of PCB to heat sink, cooling fans to devices, bonding or encapsulation of powder devices.

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.




Name

Thermobond
3519

Thermobond
3821

Thermobond
3830

ET1608

ET1642

ET1643

Chemical Base

Silicone

Silicone

Silicone / Boron Nitride

Epoxy

Epoxy

Epoxy

Features / Advantages

High thermal conductivity. Easy flow. Fast cure. Superior dielectric property

Very high thermal conductivity. Non-Slump. Fast cure

Boron nitride filled for very high thermal conductivity. High bonding Strength.

High thermal conductivity. High bonding Strength. Easy flow. Rmt curable.

High thermal conductivity. High bonding Strength. Low CTE. Easy flow

High thermal conductivity. High bonding Strength. Low CTE. Easy flow

Typical Application

For high heat dissipations potting or bonding. Applied between high heat power devices and heat sinks.

For high heat dissipations bonding. Applied between high heat power devices and heat sinks.

Strong bonding for heat dissipations in electronics. Low stress for thermally conductive vibration dampening.

Strong bonding or potting for heat dissipations in electronics.

For high heat dissipations in electronics.

Strong bonding or potting with heat dissipations in electronics.

Appearance

White - A
White - B

White - A
Grey - B

White - A
Grey - B

Off White - A
Amber - B

Grey - A
Amber - B

Off White - A
Off White - B

Rheology

Flowable

Thixotropic, Dispensable

Thixotropic, Dispensable

Flowable

Flowable

Dispensable

Viscosity @25C (cps)

96,000

160,000

230,000

180,000

90,000

180,000

Part / Component

Two parts (1:1)

Two parts (1:1)

Two parts (1:1)

Two parts (2:1)

Two parts (1:1)

Two parts (1:1)

Work life (hr)

120 min

120 min

30 min

30 min

30 min

60 min

Cure Rate

25C 4-6 hrs
125C 15 min

25C 4-6 hrs
125C 15 min

125C 15 min

25C 4 hrs
125C 10 min

85C 120 min
125C 30 min

25C 18 hrs
85C 60min

Shelf Life (days)

6 months @ < 30C

6 months @ < 30C

6 months @ < 30C

6 months @ 5C

6 months @ 5C

6 months @ 25C

Thermal Conductivity (W/mK)

1.4

2.0

3.2

1.7

1.5

2.0

Thermal Stability

-50 to 200C

-50 to 200C

-50 to 200C

-80C to 200C

-80C to 200C

-80C to 200C

Tg

-120C

-120C

-120C

85 to 125

85 to 125

75

CTE (ppm/C)

97 ppm/C

98 ppm/C

120 ppm/C

<120(> Tg)
< 30 (<Tg)

<100(> Tg)
< 30 (<Tg)

<100(> Tg)
< 30 (<Tg)

Hardness / Modulus

Shore A = 45

Shore A = 90

Shore A = 63

Shore D = 70

Shore D = 70

6.7 GPa

Tensile Strength

n/a

1.1 Mpa

2.8 Mpa

n/a

n/a

n/a

Elongation

n/a

45%

120%

n/a

n/a

n/a

Volume Resistivity
(Ohm-cm)

3x10E+14

> 10E+14

2.510E+14

> 10E+12

> 10E+12

> 10E+12

Dielectric Strength (KV/mm)

420 V/mil

> 400 V/mil

500 V/mil

500 V/mil

500 V/mil

500 V/mil

Dielectric Constant
(@ 100Hz)

4.3

3

3.5

n/a

n/a

n/a

Adhesion (Al/Al Lap Shear, psi)

> 550 psi

> 550 psi

580 psi

> 900 psi

> 1800 psi

> 1800 psi


 
 
 
   
 
   
 
   
 
   
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