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Thermal
Gap Filling Materials
E specially designed ThermoFill materials by United Adhesives
Inc. are for coupling thermal stress while dissipating heat.
They form almost “stress-free” status at interface between
electronic components and devices, which yield superior
long lifetime in thermal cycles and operations. They have
the following features:
-
High
thermal conductivity & heat dissipating capacity
- Soft
and flexible for stress free gap filling
- Flexible
cure profile. Some are room temperature curable
-
Automated
dispensable and printable
- Tack
after cure to provide necessary adhesion
- All
the ThermoFill materials are reworkable
They can be used in semiconductor, telecommunication, and
automotive electronic industries. They are typically applied
between high power devices and heat sinks, and any places
where require to couple thermal stress while dissipating
heat, or require thermally conductive vibration dampening
Click the name of the adhesive in following Table to access
its technical datasheet (TDS) in PDF file.
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