Silicone Adhesives  
 Epoxy Adhesives   
 Thermal Management  
 Coating and Potting  
 Sealing Applications   
 Contact Us   

 Contact in North America,
Europe, & Worldwide
318 Half Day Rd #189
Buffalo Grove, IL 60089, USA

 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

Contact in China and Asia 
High & New Technology
Industrial Development Park
6-1023 Tianzhu Rd.
Hefei City, China

  Phone: +86 139 5605 4600 
 china@UnitedAdhesives.com 

 

 

  Products  
  About Us   
Chinese Version

 

Thermal Gap Filling Materials

E specially designed ThermoFill materials by United Adhesives Inc. are for coupling thermal stress while dissipating heat. They form almost “stress-free” status at interface between electronic components and devices, which yield superior long lifetime in thermal cycles and operations. They have the following features:

-                High thermal conductivity & heat dissipating capacity

-                Soft and flexible for stress free gap filling

-                Flexible cure profile. Some are room temperature curable

-                Automated dispensable and printable

-                Tack after cure to provide necessary adhesion

-                All the ThermoFill materials are reworkable

They can be used in semiconductor, telecommunication, and automotive electronic industries. They are typically applied between high power devices and heat sinks, and any places where require to couple thermal stress while dissipating heat, or require thermally conductive vibration dampening

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.



Name

ThermoFill TF2620

ThermoGel TF2419

ThermoFill  TF2619

ThermoFill TF2612

Thermal Grease TG2120

Thermal Grease
TG2730

Features / Advantages

Very high thermal conductivity. BN Filled. Non-Sag. Fast cure Reworkable

Pre-formed gel type material. Dielectric. Reworkable. No need to cure

High thermal conductivity. Non-Sag. Fast cure and room temp curable. Reworkable

Extremely soft for stress free. Non-Sag. Dielectric. Reworkable. Strong tack after Cure

High thermal conductivity. Low cost. Non-Sag. Reworkable

Boron nitride as filler to reach superior thermal conductivity. No cure required

Typical Applications

For high heat dissipations in electronic devices. Applied between high heat power devices and heat sinks

Especially designed for coupling thermal stress while significantly dissipating heat in electronic devices

For electronic applications. Applied between high heat power devices & heat sinks. Excellent for thermally conductive vibration dampen

For coupling thermal stress while dissipating heat. Excellent for thermally conductive vibration dampen

For high heat dissipations in electronics. Applied between high heat power devices and heat sinks

Especially designed for high heat dissipation while providing stress-free coupling in electronic devices

Appearance

Off-White

White / Grey

White / Grey

White - A
White / Grey - B

White / Grey

White / Grey

Rheology

Dispensable, thixotropic

Extrudable

Printable, thixotropic

Dispensable

Dispensable, thixotropic

Dispensable, thixotropic

Viscosity @25C
(cps, as mixed)

180,000

30 Gram / Min (Extrusion)

260,000

55,000

180,000

250,000

Part / Component

One Part

One Part

One Part

A/B (1:1 wt mixing)

One Part

One part

Density (g/ml)

1.6

2.7

2.9

2.4

2.9

1.6

Work life (hr)

N/A

N/A

N/A

30 min

N/A

N/A

Cure Rate

125C 30 min

Not required

125C 60 min

rmT 3 hrs
125C 30 min

Not required

Not required

Shelf Life (days)

> 3 month
@ < 4C

> 6 month
@ < 30C

15 days
@ < 25C

> 6 month
@ < 30C

> 12 month
@ < 30C

> 12 month
@ < 30C

Thermal Conductivity (W/mK)

2.6

1.8

2.0

1.2

2.1

3.0

Thermal Stability

-50 to 200C

-50 to 200C

-50 to 200C

-50 to 200C

-50 to 200C

-50 to 180C

Tg

-120C

-120C

-120C

-120C

-120C

N/A

Hardness

Shore A =15

Shore OO <10

Shore OO=40

Shore OO = 45

Grease / paste

Grease / paste

Volume Resistivity
(Ohm-cm)

> 10E+14

> 10E+14

> 10E+14

> 10E+14

> 10E+14

> 10E+13

Dielectric Strength (KV/mm)

> 400 V/mil

> 400 V/mil

> 400 V/mil

> 400 V/mil

> 400 V/mil

> 400 V/mil

    

    

    

 

   
United Adhesives Inc.
Together, we will win the future!


Copyright ©

All rights reserved