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绑定和粘接应用
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美国联合胶粘剂的高性粘合剂提供电子结构的粘接，包括为严重的热冲击和振动状况下提供结合，对媒界的防腐应用。某些环氧胶粘剂可以用在其他行业，如医药和建筑。
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有些具有触变性以防止应用过程中发生流挂现象。
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高Tg配方，高温稳定性。
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非常低的热膨胀系数配方，以减少热不匹配。
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高流动性以填补渗透微裂缝和空隙。
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非常的软/柔性配方提供了橡胶的弹性。
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高电压绝缘配方等等。
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Applications
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Products
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Features / Advantages
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High Tg Adhesive
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EP1551
EP1635
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High Tg over 150C. Non-slump, low CTE
High Tg over 150C. High thermal stability
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High Voltage Resistance
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EP1646
EP1660
BS8440
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2-part, room Temp curable
One or two part, heat cure. High Tg
2-part silicone, heat cure
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High Thermal Conductivity
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ET1645
ET1649
ET1653BN
TB3508
TB3517
TB3830
Eposolder 6869
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1-part epoxy, k=1.5W/mK, flowable
1-part epoxy, k = 2.2 W/mK
1-part epoxy, k =3 W/mK, BN filled
1-part silicone, k =1W/mK, high bonding strength
1-part silicone, k= 2W/mK, high bonding strength
2-part silicone, k = 3.2 W/mK, BN filled
1-part epoxy, k=11W/mK, silver filled
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High Chemical Resistance
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EP1635
EP1636
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1-part high Tg and low CTE, heat cure
2-part structural epoxy, heat cure
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High Moisture Resistance
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EP1551
MC7130
BS8350
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2-part fast cure epoxy
Silicone moisture rubber adhesive
Silicone heat cure runner adhesive
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Fast cure
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EP1678
EP1710
EP1733
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Quick set epoxy, 2-part mixing|
Very fast cure. Cure at 185C for 5 to 7 seconds
Snap cure low CTE epoxy. Cure in seconds
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Please contact our
sales representatives or refer to website for other
products for various special applications
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左:芯片的绑定
中:底部填充
右:元件的安装
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Applications
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Products
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Features / Advantages
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Flip chip, BGA underfill
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TUF1210
UF1230
UF1240
SE1260
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Thermally
conductive underfill
Fast flow with low CTE low alpha emission
Underfill with rubber toughen for high strength
Flexible / soft underfill
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Die attach
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EP1637
EP1723
EP1678
Eposolder
6869
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Snap cure in seconds, flowabe, 1-part
Snap cure in seconds, non-slump, 1-part
2-part, room temperature curable epoxy
Extremely
high thermal conductivity k = 11 W/mK
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Low CTE bonding and encapsulation
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EP1640
EP1641
EP1641NS
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2-part 1:1 mixing low CTE epoxy. Low T curable
1-part heat cure. High thermal stability
1-part non-slumping. High Tg
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Flexible bonding & encapsulation
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EP1346
EP1386
SE1262
BS8311
BS8460
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2-part (2:1) flexible, room temp curable
2-part (1:1) flexible, room temp curable
2-part (1:1) flexible, heat cure
1-part silicone, heat cure
2-part silicone, room temp curable
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Details of the properties
these adhesives can be found by click each of the
product link
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