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Snap Cure and Reflow Curable Electrically
Conductive Adhesives
(Click the names below to access their TDS)
Eposolder
6537
Eposolder 6537 is a snap cure, electrically conductive adhesive
with an exceptionally fast cure speed (e.g. 15 seconds at
180°C). It can be cured in standard soldering reflow process.
It is silver-filled one component with long work life at
room temperature. After being cured it forms a structural
bonding adhesive with superior electrical and thermal conductivity.
Eposolder 6537 is a replacement of regular solder for Pbfree
solutions. While it forms bonds at temperatures lower than
regular soldering, it can also provide finer pitches for
electronic assembly. Eposolder 6537 is dispensable and printable.
Eposolder 6537 has a shelf life of at least 6 months when
stored at room temperature, or 12 months at 4°C refrigerator
in the originally sealed container.
Eposolder
6549
United
Adhesives’ newly developed electrically conductive adhesive,
Eposolder 6549, is a snap cure adhesive with an exceptionally
fast cure speed at elevated temperature (e.g. 15 seconds
at 180°C)
while it keeps a long work life at room temperature (e.g.
up to 6 months). It can be cured in standard soldering reflow
process. It is filled with silver-coated-copper, which provides
cost advantage over pure silver based one. After being cured
it forms a structural bonding adhesive providing electrical
and thermal conducting. Eposolder 6549 can be a replacement
of regular solder. Eposolder 6549 is dispensable and printable.
Special
Features and Benefits
• Exceptionally fast cure speed
• Good electrical conductivity
• Strong bonding strength
• High temperature stability
• Effective EMI / RFI shielding
• Low bleeding, low volatile
Typical Applications
• Die attach / chip bonding.
• Lead terminations and printed circuit
• Solder replacement as Pb-free solutions
• Conductive coating
• EMI / RFI shielding
• Shielding for aerospace electronics
• Medical Equipment
• Semiconductor and Telecommunications
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