Name

Eposolder 6503

EP1551

EP1637

EP1715

EP1723

EP1678

Features / Advantages

单组分,可迅速固化. 可印刷. 高导电和导热性. 低脱气. 单组分. 无溶剂. 强粘合力.

固化速度快，高Tg，非塌陷.各种物质的粘接力强

迅速固化. 低CTE. 对许多塑料和表面非常强的粘接.耐油耐化学性

可迅速固化环氧树脂.对各种基材有良好的粘接. 适合薄膜层压

可迅速固化环氧树脂.对各种基材有良好的粘接. 适合薄膜层压

快速固化.可以室温下固化. 对许多塑料的表面有非常强的粘接性

Typical Application

用于电子元器件, 芯片, 模块, 晶片等的低温焊接,电路印刷, 电路导通, 接地连结, EMI/RFI的屏蔽

对于芯片粘接，SMT和组件连接.在回流焊接过程中可迅速固化.热稳定性高

用于抗热冲击，振动粘接应用. 结构粘接应用. 耐油耐化学性

薄膜层压和涂层应用. 连接印刷电路板，底板，组件.

薄膜层压和涂层应用. 连接印刷电路板，底板，组件.

用于抗热冲击，振动粘接应用.结构粘接应用.

Rheology

Dispensable and Printable

Thixotropic (non-slump). Dispensable

Dispensable

Dispensable

Thixotropic (non-slump). Dispensable

Flowable, Dispensable

Appearance / Color

Silver

Off White / Brown

Off-White

Off White or Brown

Milky White Brown

Or Grey

Milky White or Amber

Part / Component

One

One Part

One Part

One Part

One Part

Two Parts

Viscosity @25C
(cps, after mixing)

65,000

26,000

45,000

28,000

45,000

120,000

Pot / Work life (hr)

> 24 hrs

6 hrs

> 24 hrs

> 24 hrs

> 24 hrs

60 min

Cure Rate

125C 12 min
185C 3 min

175C 5 min

180C 10 sec
150C 1 min

180C 10 sec
150C 360 sec

185C 10 sec
155C 1 to 2 min
105C 15 min

25C 15 hr
85C 25 min
125C 5 min

Storage

< 4C

< -15C

< 25C

< 4C

< 4C

< 25C

Shelf Life

6 month @ < 4C

3 month @ < -15C

6 month @ < 4C

6 month @ < 4C

6 month @ < 4C

12 month @ 25C

Tg

65

~ 150

145

145

145

65

CTE (ppm/C)
ASTM D3386-94

<180 (above Tg)
<40 (below Tg)

< 88 (above Tg)
< 25 (below Tg)

114 (above Tg)
35 (below Tg)

57 (<Tg)
135 (>Tg)

< 120 (>Tg)
< 50 (<Tg)

98 (above Tg)
36 (below Tg)

Modulus / Hardness

Shore D = 80

7.8 Gpa

8 Gpa

Shore D = 87

Shore D = 83

8.5 Gpa

Volume Resistivity
(Ohm-cm)

< 2x10-4

>10E11

>10E12

>10E13

>10E12

> 10E12

Dielectric Strength (V/mil)

N/A

500 V/mil

500 V/mil

> 400 V/mil

> 400 V/mil

> 500 VAC/mil

Adhesion
(Al/Al Lap Shear)

> 1100 psi

> 1800 psi

> 2300 psi

> 1800 psi

> 1500 psi

> 1800 psi