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导电应用
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美国联合胶粘剂有两类导电胶（ECA），纯银填充的硅胶（Silductor系列）和纯银填充的环氧树脂（Eposolder系列），单组分 或双组分组成。它们既可用于滴注，也可用于筛孔式(screen)
或镂花式(stencil) 模板印刷。本页所列的Silductor系列导电粘合剂有优良的柔软性，能有效地降低元器件与粘结面之间的热应力，同时保持高度的导电和导热性。
典型的应用包括传感器、磁盘驱动器中的构件的安装，flip-chip，芯片，模块，整套件，MEMS，LED驱动器的IC， CCD 芯片，晶片， CSP，等等的表面安装或包装。导电粘合剂为此类电子器件提供了优良的导电和导热界面。他们是替代焊料，芯片粘接和有铅焊接的替代品。
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Name
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Features / Advantages
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Rheology
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Part
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Volume Resistivity
(Ohm-cm)
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Hardness / Modulus
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Adhesion
Al/Al, psi
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Cure Rate
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Silductor 6310
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High conductivity. Low
stress silicone based. High moisture resistance. Reworkable.
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41,000 cPs
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1-part
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< 5x10―4
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Shore A = 45
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>150
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125C 60 min
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Silductor 6350
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Low cost alternative with Ag coated Cu as conducting media
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42,000 cPs
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1-part
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< 2x10―3
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Shore A = 68
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>180
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125C 60 min
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Silductor 6381
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Low cost alternative with Ag and Cu hybrid as conducting media
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85,000 cPs
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1-part
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< 1x10―3
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Shore A = 80
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> 230
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125C 60 min
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Eposolder 6510
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High electrical conductivity. Strong bonding strength. Dispensable
and printable
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35,000 cPs
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1-part
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< 2x10―4
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Shore D = 78
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> 1200
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125C 1hr, or 85C 2 hrs
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Eposolder 6537
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Fast cure (snap cure) epoxy-silver. Strong bonding strength. Dispensable
and printable
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48,000 cPs
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1-part
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< 2x10―4
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Shore D = 85
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> 1500
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180C 15 sec, 125C 5 min
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Eposolder 6763
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Epoxy based low cost alternative with Ag coated Cu as conducting
media
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47,000 cPs
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1-part
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< 5x10―3
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Shore D = 60
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> 800
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125C 60 min
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Eposolder 6869
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High electrical and thermal conductivity (11 W/mK). Strong bonding
strength
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98,000 cPs
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1-part
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< 1x10―4
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Shore A = 70
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> 400
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125C 60 min
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Other Products
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Eposolder 6503,
6520,
6522,
6526,
6761
– One or two part epoxy based systems with various
modifications
E-Shielding products, including acrylic Ag-Cu based
E-Shield
6037 and carbon based E-Shield
6410, provide conductive coating, RF / EMI shielding solutions
Refer to website to check the details of the properties
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各向异性导电胶 (ACA) 为倒装芯片 (Flip-Chip)，细间距芯片上薄膜(COF)，玻璃上芯片(COG) 的LCD包装，以及各种细间距组件提供高速导电互联。它们经常被用来作为应用于诸如平板显示器，液晶显示器，智能卡，相机模块，手机，直接访问式传感器，半导体封装和RFID标签等的互连材料。
美国粘合剂公司提供各种各向异性导电胶。有的ACAs使用基于金镊为导电粒子，有的则用银基导电粒子以达到较低成本的ACAs。在热压情况下, 它们都能在几秒钟内迅速固化, 与各种基材和薄膜形成良好的结构粘接，且只在z方向上导电，而在X，Y平面绝缘。
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Name
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Features / Advantages
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Rheology
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Part
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Volume Resistivity
(Ohm-cm)
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Hardness / Modulus
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Adhesion
Al/Al, psi
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Cure Rate
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AE6080
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Z-axis anisotropic electrically conductive adhesive. Gold coated
nickel as filler, 2.5 um. Snap cure with compressing
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26,000 cPs
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1-part
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> 1x10―12 (x, y dir);
z dir < 0.1 Ohm-mm2
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Shore D = 88
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> 1800
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180C 4 to 6 sec. 150C 20 sec
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AE6075
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Z-axis anisotropic electrically conductive adhesive. Gold coated
nickel as filler, 5.0 um. Snap cure with compressing
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25,000 cPs
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1-part
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> 1x10―12 (x, y dir);
z dir < 0.1 Ohm-mm2
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Shore D = 86
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> 1600
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180C 4 to 6 sec. 150C 20 sec
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AE6025
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Z-axis anisotropic electrically conductive adhesive. Silver coated
copper as filler, 6.0 um. Snap cure with compressing
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25,000 cPs
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1-part
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> 1x10―12 (x, y dir);
z dir < 0.5 Ohm-mm2
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Shore D = 82
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> 1600
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180C 4 to 6 sec. 150C 20 sec
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