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Applications
for Electrically Conducting
United Adhesives Inc. makes two categories of Electrically
Conductive Adhesives (ECA), silver filled silicones (Silductor
series) and silver filled epoxies (Eposolder series), in
both one-part and two-part systems. They are either dispensable
or screen /stencil printable. The Eposolder series provides superior bonding
strength to most common metal/alloy surfaces while maintaining
high electrical & thermal conductivity.
The typical applications are for mounting of heat sensitive
dies or components in sensors, disk drive, flip-chip, die
attach assembly or packaging, MEMS, LED Driver IC’s, CCD
chip attach, wafer lamination, CSP. Epoxy based ECAs provide
electrically conductive bonding between components and mounting
surfaces, and serve as thermal interface material for conducting
heat through heat spreader. They are alternatives for solder
replacement, chip bonding, and lead terminations.
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Click the name of the adhesive in following Table to access
its technical datasheet (TDS) in PDF file.
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Name
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Features / Advantages
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Rheology
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Part
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Volume Resistivity
(Ohm-cm)
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Hardness / Modulus
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Adhesion
Al/Al, psi
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Cure Rate
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Silductor 6310
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High conductivity. Low
stress silicone based. High moisture resistance. Reworkable.
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41,000 cPs
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1-part
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< 5x10―4
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Shore A = 45
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>150
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125C 60 min
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Silductor 6350
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Low cost alternative with Ag coated Cu as conducting media
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42,000 cPs
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1-part
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< 2x10―3
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Shore A = 68
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>180
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125C 60 min
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Silductor 6381
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Low cost alternative with Ag and Cu hybrid as conducting media
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85,000 cPs
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1-part
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< 1x10―3
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Shore A = 80
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> 230
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125C 60 min
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Eposolder 6510
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High electrical conductivity. Strong bonding strength. Dispensable
and printable
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35,000 cPs
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1-part
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< 2x10―4
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Shore D = 78
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> 1200
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125C 1hr, or 85C 2 hrs
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Eposolder 6537
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Fast cure (snap cure) epoxy-silver. Strong bonding strength. Dispensable
and printable
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48,000 cPs
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1-part
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< 2x10―4
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Shore D = 85
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> 1500
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180C 15 sec, 125C 5 min
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Eposolder 6763
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Epoxy based low cost alternative with Ag coated Cu as conducting
media
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47,000 cPs
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1-part
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< 5x10―3
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Shore D = 60
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> 800
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125C 60 min
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Eposolder 6869
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High electrical and thermal conductivity (11 W/mK). Strong bonding
strength
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98,000 cPs
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1-part
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< 1x10―4
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Shore A = 70
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> 400
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125C 60 min
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Other Products
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Eposolder 6503,
6520,
6522,
6526,
6761
– One or two part epoxy based systems with various
modifications
E-Shielding products, including acrylic Ag-Cu based
E-Shield
6037 and carbon based E-Shield
6410, provide conductive coating, RF / EMI shielding solutions
Refer to website to check the details of the properties
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Anisotropic conductive adhesives (ACA) provide high-speed interconnection
for flip chip, fine pitch chip-on-film (COF), and
chip-on-glass (COG) LCD packaging, and various fine
pitch assemblies. They are often used as interconnect
material in mainstream applications such as flat panel
displays, LCD, smart card, camera modules, mobile
phones, direct access sensors, semiconductor packages
and RFID tags.
United Adhesives makes Au-based ACAs,
and Ag-based low cost ACAs for these applications. They all have a rapid snap-cure speed at elevated temperatures in
seconds with a thermo-compression. They forms a structural
bonding to various substrates and films with conductivity
only in z-direction while remaining insulation in
the x,y plane.
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Name
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Features / Advantages
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Rheology
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Part
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Volume Resistivity
(Ohm-cm)
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Hardness / Modulus
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Adhesion
Al/Al, psi
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Cure Rate
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AE6080
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Z-axis anisotropic electrically conductive adhesive. Gold coated
nickel as filler, 2.5 um. Snap cure with compressing
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26,000 cPs
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1-part
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> 1x10―12 (x, y dir);
z dir < 0.1 Ohm-mm2
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Shore D = 88
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> 1800
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180C 4 to 6 sec. 150C 20 sec
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AE6075
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Z-axis anisotropic electrically conductive adhesive. Gold coated
nickel as filler, 5.0 um. Snap cure with compressing
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25,000 cPs
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1-part
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> 1x10―12 (x, y dir);
z dir < 0.1 Ohm-mm2
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Shore D = 86
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> 1600
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180C 4 to 6 sec. 150C 20 sec
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AE6025
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Z-axis anisotropic electrically conductive adhesive. Silver coated
copper as filler, 6.0 um. Snap cure with compressing
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25,000 cPs
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1-part
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> 1x10―12 (x, y dir);
z dir < 0.5 Ohm-mm2
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Shore D = 82
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> 1600
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180C 4 to 6 sec. 150C 20 sec
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