Features / Advantages
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Screen/Stencil Printable. High electrical
& thermal conductivity. Low Thermal Stress. Very
Low ionic Contamination. High moisture resistance.
Reworkable.
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Silver copper hybrid powder filled electrical
& thermal conductivity. Low Thermal Stress. Very
Low ionic Contamination. High moisture resistance.
Reworkable. Low cost.
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High electrical & thermal conductivity.
Low Thermal Stress. Very Low ionic Contamination.
High moisture resistance. Reworkable.
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For low stress, electrically connecting
applications. Very Low ionic Contamination. High moisture
resistance. Reworkable.
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Typical Application
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For extremely low stress soldering /
connecting / conducting applications such as in Sensors,
Filters, Crystal Oscillators, MEMS, LCD Driver IC’s,
CCD chip attach, Wafer Lamination, CSP, etc.
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For extremely low stress soldering /
connecting / conducting applications such as
in Sensors, Filters, Crystal Oscillators, MEMS,
LCD Driver IC’s, CCD chip attach, Wafer Lamination,
CSP, etc.
|
For low stress soldering / connecting
/ conducting applications such as in Sensors, Filters,
Crystal Oscillators, MEMS, LCD Driver IC’s, CCD chip
attach, Wafer Lamination, etc.
|
Low cost silver alternative electrically
conductive adhesive for conducting in semiconductor
and automotive electronics applications.
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