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Features / Advantages
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Low viscosity. Fast flow. Room temp curabe; Good adhesion to various
substrate
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Fast Cure, High Tg, Non-Slumping. Strong bonding to various substances
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High Tg formulation for high temperature stability. Strong oil
and chemical resistance
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Low CTE. Very strong bonding to many plastics and surfaces. Oil and chemical resistance
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Very Low CTE. Flowable epoxy. Strong oil and chemical resistance.
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High Voltage resistance. Low arching effect. Strong oil and chemical
resistance.
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Typical Application
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For impregnating, coating, potting Applications.
Bond to PBT, PPS, Nylon, PC, Phenolic & other
difficult materials.
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For die attach, SMT and component attach. Curable in solder reflow
process. High thermal stability
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For applications that require high temperature stability in semiconductor
and automotive electronics such as power devices and
processors.
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For severe thermal shock, vibration bonding applications. Structural
bonding applications. Oil and media resistance applications.
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For applications that require extremely low CTE bonding such as
silicon / ceramic bonding, ignition coil potting.
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For high voltage insulation seal or encapsulation.
High voltage component bonding or coating.
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CTE (ppm/C)
ASTM D3386-94
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75 to 125
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< 88 (> Tg)
< 25 (< Tg)
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< 98 (above Tg)
< 27 (below Tg)
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68 (above Tg)
19 (below Tg)
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68 (above Tg)
19 (below Tg)
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120 (above Tg)
60 (below Tg)
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