Features / Advantages
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Moisture cure soft gel. Sprayable & dispensable.
Easy applying. Excellent protection
of moisture, media, & corrosion.
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Soft coating and potting
gel. Sprayable &
dispensable. Excellent moisture & media resistance.
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Soft Non-Sag gel.
Dispensable. Excellent moisture and media resistance.
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Fast cure soft gel.
Dispensable. Easy applying. Excellent protection of
moisture, media, & corrosion.
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Firm coating and potting
gel. Sprayable &
dispensable. Excellent moisture & media resistance.
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Fast flow, soft flexible
epoxy. Excellent protection of moisture, media, &
corrosion.
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Typical Application
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Conformal coat to
protect electronics from moisture, oil, fluid, ducts,
particles, etc. and fill voids, cracks.
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For coating or potting
of electronic devices to protect dies, components,
wirebonds etc.
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For globe-top encapsulation
of electronic devices to protect chips, dies, components,
wirebonds etc.
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Coating to protect
electronics from moisture, oil, fluid, ducts, particles,
etc. and fill voids, cracks.
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For coating or potting
of electronic devices to protect die, component, wirebond,
etc.
|
Encapsulate parts,
cavities. Under-filling components, etc.
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Cure Rate
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120 um / 20 min
@ rmt 50%RH
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10 min @ 125C
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15 min @ 125C
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15 min @ 125C
60 min @ 105C
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90 min @ 105C
30 min @ 125C
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30 min @ 125C
15 min @ 150C
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