New Technologies


Snap Cure and Reflow Curable Electrically Conductive Adhesives
(Click the names below to access their TDS)

Eposolder 6537

Eposolder 6537 is a snap cure, electrically conductive adhesive with an exceptionally fast cure speed (e.g. 15 seconds at 180°C). It can be cured in standard soldering reflow process. It is silver-filled one component with long work life at room temperature. After being cured it forms a structural bonding adhesive with superior electrical and thermal conductivity. Eposolder 6537 is a replacement of regular solder for Pbfree solutions. While it forms bonds at temperatures lower than regular soldering, it can also provide finer pitches for electronic assembly. Eposolder 6537 is dispensable and printable.

Eposolder 6537 has a shelf life of at least 6 months when stored at room temperature, or 12 months at 4°C refrigerator in the originally sealed container.

Eposolder 6549

United Adhesives’ newly developed electrically conductive adhesive, Eposolder 6549, is a snap cure adhesive with an exceptionally fast cure speed at elevated temperature (e.g. 15 seconds at 180°C) while it keeps a long work life at room temperature (e.g. up to 6 months). It can be cured in standard soldering reflow process. It is filled with silver-coated-copper, which provides cost advantage over pure silver based one. After being cured it forms a structural bonding adhesive providing electrical and thermal conducting. Eposolder 6549 can be a replacement of regular solder. Eposolder 6549 is dispensable and printable.

Special Features and Benefits
• Exceptionally fast cure speed
• Good electrical conductivity
• Strong bonding strength
• High temperature stability
• Effective EMI / RFI shielding
• Low bleeding, low volatile

Typical Applications
• Die attach / chip bonding.
• Lead terminations and printed circuit
• Solder replacement as Pb-free solutions
• Conductive coating
• EMI / RFI shielding
• Shielding for aerospace electronics
• Medical Equipment
• Semiconductor and Telecommunications

Our UV fast cure epoxy adhesives provide advantages of high speed throughput in assembly processes. The UV light cure rather than heat cure is well suited for heat-sensitive electronic components or plastic parts. They have following features:

-                Fast cure under UV exposure

-                Strong bonding to various substrates with low shrinkage

-                Low bleeding, low volatile

-                Some of them are transparent for optical applications

Potential Uses
Four UV cure products are ready for selection. UV2000 is designed as low viscosity for thin-coating and potting uses. UV2010 is a non-solvent, flowable version for dispensing as conformal coating. UV2030 is a thixotropic formulation for dispensing as “globe-top” encapsulation on local parts such as chips, dies and components to provide superior selective protection. UV1216 provides low stress solutions. UV2000 and 2010 are optically clear and can be used as optical encapsulants.

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.