Features / Advantages
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Heat cure to form silicone rubber. Non-corrosion
Non-slump. Strong bonding to Al and most plastics.
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One part. Non-slump. Heat cure to form
silicone rubber. Strong bonding to Al and most plastics.
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One Part flowable. Heat cure to form
silicone rubber. Non-corrosion sealant / adhesive.
Strong bonding to Al and most plastics.
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Two part. Heat cure to form silicone
rubber. Non-corrosion sealant / adhesive.
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Flexible epoxy formulation. Two part
for fast cure. Room temperature curable.
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Very Low CTE. Thixotropic (non-sag) epoxy. Strong oil and chemical resistance.
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Typical Application
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Bonding & sealing electronic devices,
components, equipment, power control connections,
cover plates, etc. Stress release & resist. to
high temp & humidity
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Bond & seal electronic devices.
Good oil resistance. Seal lead, housing. Attach baseplate;
Gasketing; Connector seal.
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Bonding & sealing electronic devices,
components, electrical equipment, power control connections,
cover plates, etc. Stress release & resist. to
high temp & humidity
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Bond & seal electronic devices.
Good oil resistance. Seal lead, housing. Attaching
baseplate; Gasketing; Connector seal.
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For low stress bonding & flexible
seal. Bond to PBT, PPS, Nylon, PC, Phenolics and other
difficult materials.
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For applications that require extremely low CTE bonding such as
silicon / ceramic bonding, ignition coil potting.
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