Features / Advantages
|
1-part moisture Cure. Long elongation.
Non-Sag. Stress free. Strong bond to PBT, ABS, Nylon
plastics.
|
Non-corrosive, 1- part moisture cure.
Strong bond to aluminum and most plastics. Stress
compliant.
|
Non-corrosive 1-part moisture cure.
Strong bond to aluminum & most plastics. Stress
compliant.
|
Low CTE. Very strong bonding to many
plastics and surfaces. Oil and chemical resistance.
|
Addition heat fast cure. Room temp curable.
Non-Corrosive. Strong bond to most plastics. Stress
compliant.
|
Flexible epoxy formulation. Two part
for fast cure. Room temperature curable.
|
Typical Application
|
Bond & seal electronic devices,
housings, covers, etc. extreme thermal stress release;
formed-in-place gaskets.
|
Bond & seal electronic devices that
exposes to high temperature & humidity; make formed-in-place
gaskets.
|
Bond & seal electronic devices,
connectors, cover plates etc. Making formed-in-place
gaskets. General purpose sealant
|
For severe thermal shock, vibration
bonding applications. Structural bonding applications.
Oil and media resistance applications..
|
Bond & seal electronic devices.
Good oil resistance. Seal lead, housing. Attaching
baseplate; Gasketing; Connector seal.
|
For low stress bonding & flexible
seal. Bond to PBT, PPS, Nylon, PC, Phenolics and other
difficult materials.
|