Thermally
Conductive Adhesives - Two Part
United Adhesives Inc. makes thermally conductive adhesives
(TCA) for bonding electronic devices with heat dissipations.
The two-part products have following features:
-
High
thermal conductivity & heat dissipating capacity
- High
bonding strength to most common plastics and metals
- Flexible
cure profile. Some are room temperature curable
-
Automated
dispensable and printable
- Soft
and flexible to couple thermal stress while dissipating
heat
- High
dielectric strength for voltage insulation
Structural bonding epoxy based thermally conductive adhesives
are also available.
Potential Uses
For high heat dissipation bonding in automotive electronics,
semiconductors, and telecommunications, typically applied
between high heat power device and heat sink; or any places
where require coupling thermal stress while dissipating
heat, or require thermally conductive vibration dampening;
attachment of PCB to heat sink, cooling fans to devices,
bonding or encapsulation of powder devices.
Click the name of the adhesive in following Table to access
its technical datasheet (TDS) in PDF file.
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