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Features / Advantages
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Translucent fluid
silicone. Readily flowable. Thermal cure to form firm
rubbery dielectric
gel. Non-corrosive.
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One part version of SP4012. Readily
flowable. Thermal cure to form firmrubbery dielectric
gel. Non-corrosive.
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One part dielectric firm gel.
Non-sag (thixotropic).
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Transparent epoxy
potting or sealing for Opto-Electronic Applications.
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High thermal conductivity.
High bonding Strength. Low CTE. Easy flow
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High voltage resistance.
Low arching effect. Strong oil and chemical resistance.
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Typical Application
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Pot / encapsulate
parts & cavities. Seal housings, lids. Coat electronic parts. Vibration dampening Thermal stress coupling
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Pot / encapsulate
parts & cavities. Seal housings, lids. Coat electronic parts. Vibration dampening Thermal stress coupling
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Encapsulate parts
& cavities. Seal housings, lids. Coat electronic parts. Vibration dampening Thermal stress coupling
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Applying on LED Glob-Top,
Optical Lens & IR Lens, Fiber optical, Lens, Prism,
Endoscopes or Light Guides, etc.
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Potting or sealing
for high heat dissipations in electronics.
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For high voltage insulation
seal or encapsulation. High voltage component
bonding or coating.
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CTE (ppm/C)
ASTM D3386-94
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< 300
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< 300
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< 300
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123 (above Tg)
58 (below Tg)
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<100(> Tg)
< 30 (<Tg)
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120 (above Tg)
60 (below Tg)
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