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Applications
for Thermal Conducting and Heat Dissipation
United Adhesives Inc. makes thermally conductive adhesives
(TCA) for bonding electronic devices with heat dissipations.
They have following features:
· Very high thermal conductivity.
· High bonding strength to most common
plastics and metals
· Soft rubber and flexible (Thermondbond
series) to couple thermal stress while dissipating heat
· High dielectric strength for voltage
insulation
Potential Uses
For high heat dissipation bonding in automotive electronics,
semiconductors, and telecommunications, typically applied
between a high heat power device and heat sink; any places
where require coupling thermal stress while dissipating
heat, or require thermally conductive vibration dampening;
attachment of PCB to heat sink, cooling fans to devices,
bonding or encapsulation of powder devices.
Click the name of the adhesive in following Table to access
its technical datasheet (TDS) in PDF file.
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Name
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Features / Advantages
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Rheology
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Part
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Thermal Conductivity
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Hardness / Modulus
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Adhesion
Al/Al, psi
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Cure Rate
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Thermobond 3513
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Silicone with high bonding Strength. Low stress
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Flowable
56,000 cPs
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1-part
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1.4 W/mK
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Shore A =70
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> 600
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125C
60 min
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Thermobond 3517
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Silicone with high thermal conductivity. Strong bonding. Non-Slump
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Thixotropic,
120,000 cPs
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1-part
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1.9 W/mK
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Shore A = 90
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> 550
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125C
60 min
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Thermobond 3831
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Boron nitride filled for very high thermal conductivity
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Thixotropic,
230,000 cPs
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1-part
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3.2 W/mK
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Shore A = 63
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580
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125C
45 min
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ET1628
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High thermal conductivity. High bonding Strength. Easy flow. Rmt
curable.
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220,000 cPs
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2-part
2 : 1
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2.3 W/mK
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Shore D = 70
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> 1500
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25C 8hrs, or 105C 10 min
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ET1643
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High thermal conductivity. High bonding Strength. Easy flow. Low
CTE.
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210,000 cPs
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2-part
1 : 1
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1.7 W/mK
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6.7 GPa
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> 1800
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25C 18hrs, or 125C 30 min
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ET1645
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High thermal conductivity. Good flow. High bonding Strength.
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50,000 cPs
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1-part
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2.3 W/mK
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Shore D = 90
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> 1000
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125C
30 min
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TF2619
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High thermal conductivity gap filling silicone
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Thixotropic,
230,000 cPs
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1-part
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1.9 W/mK
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Shore OO=40
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N/A
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125C
45 min
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Eposolder 6869
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Silver filled epoxy for extremely high thermal conductivity
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98,000 cPs
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1-part
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11 W/mK
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Shore A = 70
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> 400
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125C
60 min
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Other Products
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Thermobond 3508,
3519,
3821,
3830
– One or two-pat silicone systems with various modifications
ET1608,
1642,
1645NS,
1653BN,
1655,
1658
– One or two part
epoxy systems with various modifications
Refer to website to check the details of the properties
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