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Anisotropic Conductive Adhesives

Anisotropic conductive adhesives (ACA) provide high-speed interconnection for flip chip, fine pitch chip-on-film (COF), and chip-on-glass (COG) LCD packaging, and various fine pitch assemblies. They are often used as interconnect material in mainstream applications such as flat panel displays, LCD, smart card, camera modules, mobile phones, direct access sensors, semiconductor packages and RFID tags.

United Adhesives makes Au-based ACAs, and Ag-based low cost ACAs for these applications. They all have a rapid snap-cure speed at elevated temperatures in seconds with a thermo-compression. They forms a structural bonding to various substrates and films with conductivity only in z-direction while remaining insulation in the x,y plane.

                     

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.


        

Name

AE 6080

AE 6075

AE 6025

Features / Advantages

Au-Ni conducting particles. Size ~2.5 um. Low cost. Snap cure in seconds.

Au-Ni conducting particles. Mono-size 5.0 um. Flexible for compression. Snap cure in seconds.

Ag-Cu conducting particles. Size ~ 6.0 um. Snap cure in seconds.

Typical Applications

Interconnection for flip chip, fine pitch chip-on-film (COF), and chip-on-glass (COG) LCD packaging, and various fine pitch assemblies

Interconnection for flip chip, fine pitch chip-on-film (COF), and chip-on-glass (COG) LCD packaging, and various fine pitch assemblies

Interconnection for flip chip, fine pitch chip-on-film (COF), and chip-on-glass (COG) LCD packaging, and various fine pitch assemblies

Appearance

Dark Brown

Dark Brown

Light Brown

Part / Component

One Part

One Part

One Part

Rheology

Dispensable

Dispensable

Dispensable

Viscosity @25C (cps)

26,000

25,000

26,000

Thixtropic Index

3.0

2.5

1.5

Density (g/ml)

1.3

1.3

1.3

Work life (hr)

> 48 hrs

> 48 hrs

> 48 hrs

Cure Rate

180C 6 sec
150C 20 sec

180C 7 sec
150C 25 sec

180C 6 sec
150C 20 sec

Shelf Life (days)

> 6 month
@ < 4C

> 6 month
@ < 4C

> 6 month
@ < 4C

Hardness

Shore D = 88

Shore D = 86

Shore D = 82

Contact Resistivity, Ohm/mm2
(z direction, 24C)

< 0.1

< 0.1

< 0.2

Volume Resistivity, Ohm-cm
(x, y direction, 24C)

> 10E+12

> 10E+12

> 10E+12

Coefficient of Thermal
Expansion (ppm/C)

< 160 (above Tg)
< 60 (below Tg)

< 160 (above Tg)
< 62 (below Tg)

< 162 (above Tg)
< 65 (below Tg)

Tg

125

125

135

Adhesion
(Al/Al lap shear)

> 1800 psi

> 1600 psi

> 1600 psi


 


The Anisotropic Conductive Adhesives (ACA) made by United Adhesives conduct only in z-axis due to careful control of the distribution of the electrically conductive filler (gold coated, or silver particles) in the adhesive matrix.

Conductivity is achieved through continuous contact of the fillers with the bumps and bond pads of the opposing substrates after heat and pressure being applied to compress the entrapped conductive particles. The epoxy matrix with the remaining particles between the raised areas of the substrates acts as an insulator, preventing current flow in any other directions.

These adhesives can be applied with dispensing, stencil or screen-printing. Cure can be complete at 180C under the compression force in less than 7 seconds. The gold particles have stable electrical contact resistance when subjected to humidity and thermal cycling.

United Adhesives provides strong bonds to fine pitches with very fast assembling process. Testing results show that pitches of 80 microns (70 micron bumps with 10 micron separation) showed no circuit short
.

   
United Adhesives Inc.
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