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 Contact in North America,
Europe, & Worldwide
318 Half Day Rd #189
Buffalo Grove, IL 60089, USA

 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

Contact in China and Asia 
High & New Technology
Industrial Development Park
6-1023 Tianzhu Rd.
Hefei City, China

  Phone: +86 139 5605 4600 
 china@UnitedAdhesives.com 

 

 

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Snap Cure / Fast Cure Adhesives

United Adhesives Inc. makes fast cure / snap cure epoxy adhesives for electronic structural bonding, film lamination, severe thermal shock and vibration bonding, and media resistance applications. Some epoxy adhesives can be cured in seconds at elevated temperature, such as EP1715, EP1723, while they still keep long pot life at room temperature.

Following are some features:

- Structual bonding epoxy to anti-sag in processing.
- High Tg formulation for high temperature stability.
- Very low CTE formulation to minimize the thermal mismatch.
- Electrically conductive bonding
- Very soft / flexible epoxy formulation offering rubbery flexibility.
- High voltage insulation formulation.

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.


Name

Eposolder 6503

EP1551

EP1637

EP1715

EP1723

EP1678

Features / Advantages

Snap cure. High electrical & thermal conductivity. Very low out-gassing. Strong bonding strength.

Fast Cure, High Tg, Non-Slumping. Strong bonding to various substances

Sanp Cure. Low CTE. Very strong bonding to many plastics and surfaces.  Oil and chemical resistance

Snap Cure epoxy. Good bonding to various substrates. Good for film lamination

Snap Cure epoxy. Non-slump. Good bonding to various substrates. Good for film lamination

Quick Cure. Rmt curable. Very strong bonding to many plastics and surfaces.

Typical Application

For die attach, solder replacement, chip bonding, lead terminations, printed circuit, EMI / RFI shielding.

For die attach, SMT and component attach. Curable in solder reflow process. High thermal stability

For severe thermal shock, vibration bonding applications. Structural bonding applications. Oil and media resistance applications.

For film lamination and coating applications. Attach PCBs, base plates, components.

For film lamination and coating applications. Attach PCBs, base plates, components.

For thermal shock, vibration bonding applications. Structural bonding applications.

Rheology

Dispensable and Printable

Thixotropic (non-slump). Dispensable

Dispensable

Dispensable

Thixotropic (non-slump). Dispensable

Flowable, Dispensable

Appearance / Color

Silver

Off White / Brown

Off-White

Off White or Brown

Milky White Brown
Or Grey

Milky White or Amber

Part / Component

One

One Part

One Part

One Part

One Part

Two Parts

Viscosity @25C
(cps, after mixing)

65,000

26,000

60,000

28,000

45,000

120,000

Pot / Work life (hr)

> 24 hrs

6 hrs

> 24 hrs

> 24 hrs

> 24 hrs

60 min

Cure Rate

125C 12 min
185C 3 min

175C 5 min

180C 10 sec
150C 1 min

180C 10 sec
150C 30 sec

185C 10 sec
155C 1 to 2 min
105C 15 min

25C 15 hr
85C 25 min
125C 5 min

Storage

< 4C

< -15C

< 25C

< 4C

< 4C

< 25C

Shelf Life

6 month @ < 4C

3 month @ < -15C

6 month @ < 4C

6 month @ < 4C

6 month @ < 4C

12 month @ 25C

Tg

65

~ 150

145

125

145

65

CTE (ppm/C)
ASTM D3386-94

<180 (above Tg)
<40 (below Tg)

< 88 (above Tg)
< 25 (below Tg)

89(above Tg)
22 (below Tg)

57 (<Tg)
135 (>Tg)

< 120 (>Tg)
< 50 (<Tg)

98 (above Tg)
36 (below Tg)

Modulus / Hardness

Shore D = 80

7.8 Gpa

8 Gpa

Shore D = 87

Shore D = 83

8.5 Gpa

Volume Resistivity
(Ohm-cm)

< 2x10-4

>10E11

>10E12

>10E13

>10E12

> 10E12

Dielectric Strength (V/mil)

N/A

500 V/mil

500 V/mil

> 400 V/mil

> 400 V/mil

> 500 VAC/mil

Adhesion
(Al/Al Lap Shear)

> 1100 psi

> 1800 psi

> 2300 psi

> 1800 psi

> 1500 psi

> 1800 psi




 
 

                 
   
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