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 Contact in North America,
Europe, & Worldwide
318 Half Day Rd #189
Buffalo Grove, IL 60089, USA

 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

Contact in China and Asia 
High & New Technology
Industrial Development Park
6-1023 Tianzhu Rd.
Hefei City, China

  Phone: +86 139 5605 4600 
 china@UnitedAdhesives.com 

 

 

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New Technologies


Snap Cure and Reflow Curable Electrically Conductive Adhesive - Eposolder 6537


Eposolder 6537 is a snap cure, electrically conductive adhesive with an exceptionally fast cure speed (e.g. 15 seconds at 180°C). It can be cured in standard soldering reflow process. It is silver-filled one component with long work life at room temperature. After being cured it forms a structural bonding adhesive with superior electrical and thermal conductivity. Eposolder 6537 is a replacement of regular solder for Pbfree solutions. While it forms bonds at temperatures lower than regular soldering, it can also provide finer pitches for electronic assembly. Eposolder 6537 is dispensable and printable.

Eposolder 6537 has a shelf life of at least 6 months when stored at room temperature, or 12 months at 4°C refrigerator in the originally sealed container.








 

 



United Adhesives' silicone based electrically conductive adhesive, Silductor 6310, has successfully assisted the prototype build of a new generation photovoltaic technology. A leading technology company in Denmark has developed a new generation of solar panel with more energy than standard solutions. Our silicone based electrically conductive adhesive has been applied for this application with its superior electrical conductivity, flexibility and thermal stability.
United Adhesives' thermally conductive adhesive ThermoBond 3519 that has high dielectric insulation property has been applied in new LED lighting system. It passes < 0.1 mA current leakage requirement with 4000 Volts 60 Hz loading, which provides superior energy saving capability beyond thermal dissipation feature.

 

 











        United Adhesives' Underfill 1230 has been adopted in the GDP Global's WebFlow technology
        for fast and accurate dispensing:
        http://www.gpd-global.com/text/product/valve_webflow.html


        Surface Wet Chemical Treatment to Improve the Adhesion of Teflon (PDF File)

        单分子涂层技术及电缆抗冰凌应用的概要
        (Outline of Self-Assembly Monolayer Coating Technology and Its Application
        in Preventing Ice Formation on High-Voltage Power Lines) (PDF File)

    

        New Product



        UV Cure Adhesives for Potting Coating and Bonding

Our UV fast cure epoxy adhesives provide advantages of high speed throughput in assembly processes. The UV light cure rather than heat cure is well suited for heat-sensitive electronic components or plastic parts. They have following features:

-                Fast cure under UV exposure

-                Strong bonding to various substrates with low shrinkage

-                Low bleeding, low volatile

-                Some of them are transparent for optical applications

Potential Uses
Four UV cure products are ready for selection. UV2000 is designed as low viscosity for thin-coating and potting uses. UV2010 is a non-solvent, flowable version for dispensing as conformal coating. UV2030 is a thixotropic formulation for dispensing as “globe-top” encapsulation on local parts such as chips, dies and components to provide superior selective protection. UV1216 provides low stress solutions. UV2000 and 2010 are optically clear and can be used as optical encapsulants.

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.



Name

UV2000

UV2010

UV2016

UV2030

Chemical Base

Epoxy Acrylate

Epoxy acrylate

Modified Epoxy acrylate

Epoxy acrylate

Features / Advantages

Water clear, low viscosity for coating and potting.  Cure in seconds under UV light. Strong adhesion to various substrates.

Water clear and flowable for bonding and encapsulation.  Cure in seconds under UV light. Strong bonding strength to various glasses, metals, ceramics and plastics.

Flexible formulation for lower stress bonding, sealing, coating and encapsulating applications.  Cure in seconds under UV light.

Non-slump for bonding and sealing applications.  Cure in seconds under UV light. Strong bond to various substrate such as glass, metal, ceramic and plastics.

Typical Application

Coating / potting of electronic devices, optical cables and parts, connectors and terminations, LCD backlighting, displays, traffic and other lightings, coating potting LED devices, optical replications, and variety of  optoelectronic components.

For bonding fiber-optic cables, connectors and terminations, LCD backlighting, displays, traffic and other lightings, cementing and coating optical parts, potting LED devices, and optical components.

For bonding / sealing / potting electronic and optical parts, potting LED devices, and optical components, providing vibration and shock resistance of electro-optic assemblies.

For bonding and sealing optoelectronic devices, cables, connectors and terminations, LCD backlighting, displays, traffic and other lightings.

Appearance / Color

Water Clear Transparent

Water Clear Transparent

Opaque yellow

Opaque White

Rheology

Dispensable / Sprayable

Dispensable

Dispensable

Dispensable
Non-sag

Part / Component

One

One

One

One

Viscosity @25C (cps)

3,000

22,000

45,000

82,000

Density (g/cc)

1.1

1.1

1.1

1.1

Cure Rate, UV A (220 and 365 nm) Mercury H bulb, 100mW/cm2

20 seconds

20 seconds

30 seconds

20 seconds

Cure Rate, UV A (300 to 365 nm)Iron D bulb, 120 mW/cm2

30 seconds

30 seconds

40 seconds

30 seconds

Shelf / Pot / Work Life at 25°C (no UV exposure)

12 Months

12 Months

12 Months

12 Months

Hardness (ASTM D2240)

Shore D = 75

Shore D = 76

Shore A = 68

Shore D = 78

Volume Resistivity (Ohm-cm)

> 10E13

> 10E13

> 10E14

> 10E13

Dielectric Strength (KV/mm)

> 400 V/mil

> 400 V/mil

> 400 V/mil

> 400 V/mil

Temperatures Usage

-80C to 180C

-80C to 180C

-80C to 180C

-80C to 180C

Coefficient of Thermal Expansion, ppm/°C

63 (<Tg)
124 (>Tg)

60 (<Tg)
120 (>Tg)

76 (<Tg)
131 (>Tg)

58 (<Tg)
115 (>Tg)

Tg (°C)

85

95

< 5

95

Refractive Index

1.51

1.52

N/A

N/A

Adhesion
(Glass to / Al lap
shear, Psi)

> 700

> 700

> 700

> 700

   
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