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Bonding,
Joining and Die Attachment Applications
United Adhesives Inc. makes high performance epoxy adhesives
for electronic structural bonding, severe thermal shock
and vibration bonding, and media resistance applications.
Some epoxy adhesives can be used in other industries such
as medicine and construction.
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Thixotropic
bonding epoxy to anti-sag in processing.
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High
Tg formulation for high temperature stability.
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Very
low CTE formulation to minimize the thermal mismatch.
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High
flow and penetration to fill micro cracks and voids
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Very
soft / flexible epoxy formulation offering rubbery flexibility.
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High
voltage insulation formulation
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UV
curable and pre-UV exposure and curable after assembly.
Click
the name of the adhesive in following Table to access its
technical datasheet (TDS) in PDF file.
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Applications
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Products
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Features / Advantages
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High Tg Adhesive
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EP1551
EP1635
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High Tg over 150C. Non-slump, low CTE
High Tg over 150C. High thermal stability
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High Voltage Resistance
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EP1646
EP1660
BS8440
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2-part, room Temp curable
One or two part, heat cure. High Tg
2-part silicone, heat cure
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High Thermal Conductivity
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ET1645
ET1649
ET1653BN
TB3508
TB3517
TB3830
Eposolder 6869
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1-part epoxy, k=1.5W/mK, flowable
1-part epoxy, k = 2.2 W/mK
1-part epoxy, k =3 W/mK, BN filled
1-part silicone, k =1W/mK, high bonding strength
1-part silicone, k= 2W/mK, high bonding strength
2-part silicone, k = 3.2 W/mK, BN filled
1-part epoxy, k=11W/mK, silver filled
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High Chemical Resistance
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EP1635
EP1636
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1-part high Tg and low CTE, heat cure
2-part structural epoxy, heat cure
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High Moisture Resistance
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EP1551
MC7130
BS8350
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2-part fast cure epoxy
Silicone moisture rubber adhesive
Silicone heat cure runner adhesive
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Fast cure
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EP1678
EP1710
EP1733
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Quick set epoxy, 2-part mixing|
Very fast cure. Cure at 185C for 5 to 7 seconds
Snap cure low CTE epoxy. Cure in seconds
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Please contact our
sales representatives or refer to website for other
products for various special applications
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Left:
Die attachement Middle:
Die Under-filling Right:
Component attachment
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Applications
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Products
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Features / Advantages
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Flip chip, BGA underfill
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TUF1210
UF1230
UF1240
SE1260
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Thermally
conductive underfill
Fast flow with low CTE low alpha emission
Underfill with rubber toughen for high strength
Flexible / soft underfill
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Die attach
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EP1637
EP1723
EP1678
Eposolder
6869
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Snap cure in seconds, flowabe, 1-part
Snap cure in seconds, non-slump, 1-part
2-part, room temperature curable epoxy
Extremely
high thermal conductivity k = 11 W/mK
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Low CTE bonding and encapsulation
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EP1640
EP1641
EP1641NS
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2-part 1:1 mixing low CTE epoxy. Low T curable
1-part heat cure. High thermal stability
1-part non-slumping. High Tg
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Flexible bonding & encapsulation
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EP1346
EP1386
SE1262
BS8311
BS8460
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2-part (2:1) flexible, room temp curable
2-part (1:1) flexible, room temp curable
2-part (1:1) flexible, heat cure
1-part silicone, heat cure
2-part silicone, room temp curable
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Details of the properties
these adhesives can be found by click each of the
product link
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